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MINI-Compact System Model Name

MX-H630

Model Code

MX-H630/ZP

SERVICE

MANUAL

MINI-Compact System

Contents 1. Precaution 2. Product Specification 3. Disassembly and Reassembly 4. Troubleshooting 5. PCB Diagram 6. Schematic Diagram

MX-H630

Refer to the service manual in the GSPN (see the rear cover) for more information.

Contents

Contents 1.

2.

Precaution........................................................................................................................................ 1 − 1 1.1.

Safety Precautions ................................................................................................................... 1 − 1

1.2.

Servicing Precautions ............................................................................................................... 1 − 3

1.3.

Precautions for Electrostatically Sensitive Devices (ESDs) .............................................................. 1 − 4

1.4.

Installation Precautions ............................................................................................................. 1 − 5

Product Specification ......................................................................................................................... 2 − 1 2.1.

Product Feature ....................................................................................................................... 2 − 1

2.2.

Specifications.......................................................................................................................... 2 − 2

2.3.

Specifications Analysis ............................................................................................................. 2 − 3

2.4.

Accessories ............................................................................................................................ 2 − 4 2.4.1.

3.

4.

Disassembly and Reassembly .............................................................................................................. 3 − 1 3.1.

Main Disassembly and Reassembly ............................................................................................. 3 − 1

3.2.

DECK Disassembly and Reassembly ........................................................................................... 3 − 5

Troubleshooting ................................................................................................................................ 4 − 1 4.1.

4.2.

Checkpoints by Error Mode ....................................................................................................... 4 − 1 4.1.1.

No Power................................................................................................................... 4 − 2

4.1.2.

No Output .................................................................................................................. 4 − 4

Measures to be taken when the Protection Circuit operates............................................................... 4 − 5 4.2.1.

Operation of Power Block Protection Circuit .................................................................... 4 − 5

4.2.2.

Check AMP in Power Protection .................................................................................... 4 − 6

4.3.

MICOM, MPEG Initialization & Update ...................................................................................... 4 − 7

4.4.

Buyer-Region Code Setting Method ............................................................................................ 4 − 8 4.4.1.

5.

5.1.

Wiring Diagram....................................................................................................................... 5 − 1

5.2.

FRONT PCB Top .................................................................................................................... 5 − 2 Pin Connection ........................................................................................................... 5 − 3

5.3.

FRONT PCB Bottom ............................................................................................................... 5 − 4

5.4.

MAIN PCB Top ...................................................................................................................... 5 − 5 5.4.1.

Pin Connection ........................................................................................................... 5 − 6

5.4.2.

Test Point Wave Form .................................................................................................. 5 − 7

5.5.

MAIN PCB Bottom.................................................................................................................. 5 − 8

5.6.

SMPS PCB Top....................................................................................................................... 5 − 9 5.6.1.

5.7.

Pin Connection ........................................................................................................... 5 − 10

SMPS PCB Bottom .................................................................................................................. 5 − 11

Schematic Diagram ........................................................................................................................... 6 − 1 6.1.

i

The inserting method of Region Code after replacing the Main PBA ..................................... 4 − 8

PCB Diagram ................................................................................................................................... 5 − 1

5.2.1.

6.

Supplied Accessories ................................................................................................... 2 − 4

Overall Block Diagram ............................................................................................................. 6 − 1 Copyright© 1995-2013 SAMSUNG. All rights reserved.

Contents

6.2.

FRONT ................................................................................................................................. 6 − 2

6.3.

MAIN-1................................................................................................................................. 6 − 3

6.4.

MAIN-2................................................................................................................................. 6 − 4

6.5.

MAIN-3................................................................................................................................. 6 − 5 6.5.1.

Test Point Wave Form .................................................................................................. 6 − 6

6.6.

MAIN-4................................................................................................................................. 6 − 7

6.7.

SMPS-1 ................................................................................................................................. 6 − 8

6.8.

SMPS-2 ................................................................................................................................. 6 − 9

Copyright© 1995-2013 SAMSUNG. All rights reserved.

ii

1. Precaution

1. Precaution Follow these safety instructions while servicing the ESD to prevent damage and to protect against potential hazards such as electrical shock and X-rays.

1.1. Safety Precautions 1) When reinstalling the chassis and its assemblies, be sure to restore all of the protective devices, including the control knobs and the compartment covers. 2) Make sure that there are no cabinet openings through which people (particularly children) can make contact with dangerous internal components. 3) Design Alteration Warning: Never alter or add to the mechanical or electrical design of the unit. Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard. Also, any design changes or additions will void the manufacturer’s warranty. 4) Leakage Current Hot Check Figure 1.1 AC Leakage Test: WARNING Do not use an isolation transformer during this test. Use a leakage-current tester or a metering system that complies.

With the unit completely reassembled, plug the AC cord directly into a AC outlet. With the unit’s power switched from the ON to the OFF position, measure the current between a known ground and all exposed metal parts. Known Grounds - Earth Known Metal parts - screwheads, metal cabinets, etc.

LEAKAGE (READING CURRENT SH OULD NOT BE TES TER ABOVE 0.5mA)

DEVICE UNDER TES T TES T ALL EXPO S ED METAL SU RFACES 2-WIRE CORD ALSO TES T WITH PLUG REVER S ED (US ING AC ADAPTER P LUG AS R EQ UIRED)

EARTH GROUND

Figure 1.1 AC Leakage Test

1-1

Copyright© 1995-2013 SAMSUNG. All rights reserved.

1. Precaution

5) Insulation Resistance Cold Check: (1) With the unit’s AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs. (2) Set the power switch to ON. (3) Measure the resistance between the shorted AC plug and any exposed metallic parts. Example: screwheads, metal cabinets, antenna port, etc. If any of the exposed metallic parts has a return path to the chassis, the measured resistance should be between 1 and 5.2 megohms. If there is no return path, the measured resistance should be “infinite.” If the resistance is outside these limits, a shock hazard might exist. See Figure 1.2 Insulation Resistance Test

Ante nna Term inal

Expo s ed Meta l P a rt oh m Ohmmet er

Figure 1.2 Insulation Resistance Test

6) Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced with parts that meet the original specifications. Always determine the cause of damage or overheating, and correct any potential hazards. 7) Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and especially the AC and high voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring. Do not change the spacing between components and the printed circuit board. Check the AC power cord for damage. Make sure that no wires or components touch thermally hot parts. 8) Product Safety Notice: Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visual inspection. These safety features and the protection they give might be lost if the replacement component differs from the original—even if the replacement is rated for higher voltage, wattage, etc. 9) Components that are critical for safety are indicated in the circuit diagram by shading, or . Use replacement components that have the same ratings, especially for flame resistance and dielectric strength specifications. A replacement part that does not have the same safety characteristics as the original might create shock, fire or other hazards.

Copyright© 1995-2013 SAMSUNG. All rights reserved.

1-2

1. Precaution

1.2. Servicing Precautions 1) Servicing precautions are printed on the cabinet. Follow them. 2) Always unplug the unit’s AC power cord from the AC power source before attempting to : (a) Remove or reinstall any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a test component in parallel with an electrolytic capacitor. 3) Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used. The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such elements to their original position. 4) After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that the portion around the serviced part has not been damaged. 5) Check the insulation between the blades of the AC plug and accessible conductive parts (examples : metal panels, input terminals and earphone jacks). 6) Insulation Checking Procedure : Disconnect the power cord from the AC source. Connect an insulation resistance meter (500 V) to the blades of the AC plug. The insulation resistance between each blade of the AC plug and accessible conductive parts (see above) should be greater than 1 megohm. 7) Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless all solid-state heat sinks are correctly installed. 8) Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead; always remove the instrument’s ground lead last. CAUTION First read the “Safety Precautions” section of this manual. If some unforeseen circumstance creates a conflict between the servicing and safety precautions, always follow the safety precautions.

1-3

Copyright© 1995-2013 SAMSUNG. All rights reserved.

1. Precaution

1.3. Precautions for Electrostatically Sensitive Devices (ESDs) Some semiconductor (“solid state”) devices are easily damaged by static electricity. Such components are called Electrostatically Sensitive Devices (ESDs). Examples include integrated circuits and some field-effect transistors. The following techniques will reduce the occurrence of component damage caused by static electricity : 1) Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from your body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove it prior to applying power–this is an electric shock precaution.) 2) After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent accumulation of electrostatic charge. 3) Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs. 4) Use only a grounded-tip soldering iron when soldering or unsoldering ESDs. 5) Use only an anti-static solder removal device. Many solder removal devices are not rated as “anti-static” (these can accumulate sufficient electrical charge to damage ESDs). 6) Do not remove a replacement ESD from its protective package until you are ready to install it. Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum foil or other conductive materials. 7) Immediately before removing the protective material from the leads of a replacement ESD, touch the protective material to the chassis or circuit assembly into which the device will be installed. 8) Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together, or lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.

Copyright© 1995-2013 SAMSUNG. All rights reserved.

1-4

1. Precaution

1.4. Installation Precautions 1) Keep the product away from a heat source such as candle light, mosquito repellent incense, heating equipment, or direct sunlight. Otherwise, this may cause fire. 2) Do not install the product on a place that is shaking, tilted, unstable, or seriously vibrating. The product may drop to get damaged or injure a person. If using the product in a highly vibrating place, it may be broken or cause fire. 3) When moving the product, turn off the power switch and unplug all the connected cables with the product such as the power plug and antenna cable. If the power cord is damaged, this may cause electric shock or fire. 4) Secure room for ventilation. Keep at least 10 cm of distance from the rear wall, and at least 5 cm from either side wall. 5) Installing the product in a special place like below rather than normal environment may cause serious quality concerns due to its special conditions. If this is the case, make sure to contact a local Samsung service center before installing the product. (Special places: a place where a large amount of dust is accumulated; where chemical substances are used or the ambient temperature is too high or low; a place that is full of moisture or water; in transportation vehicles such as a car; or in public places such as the airport or subway station where the product is supposed to operate uninterruptedly for a long time) 6) Keep the packaging plastic wrapper out of children's reach. If children play with it improperly, they may get suffocated. 7) If installing the product on a display cabinet, shelf, desk, etc., keep the product from protruding on its lower side. If the product falls, it may break or cause physical injury. Use only the display cabinet or shelf that fully covers the product. 8) If using lithium batteries, carefully read the following precautions: NOTE •

Ensure the batteries are inserted in the right direction. Otherwise, they may cause an explosion. Dispose of used batteries according to the manufacturer's instructions.

•

Do not expose the battery to fire.

•

Do not disassemble, short - cut, or heat the battery.

•

Use only the same type and size of batteries for replacement.

•

Do not expose the battery to fire or excessive heat.

1-5

Copyright© 1995-2013 SAMSUNG. All rights reserved.

2. Product Specification

2. Product Specification 2.1. Product Feature ■ Power

• 2.0 ch : 230 W Total RMS / 2640 W PMPO • IR Amp ■ Specialized Function

• CD Ripping (Able to ripping while listening) • New Bass Sound System (Called GIGA Sound) • Connectivity • USB • MIC ■ Disc

• Type : 1 Tray • Compatible : MP3, CD / CD-R, RW, WMA

Copyright© 1995-2013 SAMSUNG. All rights reserved.

2-1

2. Product Specification

2.2. Specifications ■ Basic Specification Weight

2.3 Kg

Dimensions

203 (W) x 306 (H) x 256.5 (D) mm

Operating Temperature Range

+5 °C ~ +35 °C

Operating Humidity Range

10 % to 75 %

Signal/Noise ratio

55 dB

Usable sensitivity

12 dB

Total harmonic distortion

0.6 %

Signal/Noise ratio

35 dB

Usable sensitivity

58 dB

Total harmonic distortion

1.5 %

General

FM Tuner

AM Tuner (optional)

Reading Speed : 4.8 ~ 5.6 m/sec. CD Disc

CD : 12 cm (Compact Disc) Maximum Play Time : 74 min. MX-H630 : 230 Watts (MAX) Front speaker output

110 W/CH (4 Ω/100 Hz) MX-H730 : 550 Watts (MAX)

Front speaker output

275 W/CH (4 Ω/100 Hz)

Amplifier Frequency range

20 Hz ~ 20 KHz

S/N Ratio

80 dB

Channel separation

65 dB

Input sensitivity

(AUX) 800 mV

NOTE • Samsung Electronics Co., Ltd reserves the right to change the specifications without notice. • Weight and dimensions are approximate. • Design and specifications are subject to change without prior notice. • For the power supply and Power Consumption, refer to the label attached to the product.

2-2

Copyright© 1995-2013 SAMSUNG. All rights reserved.

2. Product Specification

2.3. Specifications Analysis MX‐‐H630

MX-F630 / MX-F630B / MX-F630DB

OUTPUT POWER

2.0CH 230W

2.0 CH 220 W

FRONT DISPLAY

VFD

VFD

DIMMER

O

O

CD/DVD

CD

Bluetooth

O

MX-F630B, MX-F630DB Only

MP3

O

O

USB HOST

O

O

CD RIPPING

O

O

TAPE

X

X

AUDIO IN

O

O

HEADPHONE

X

X

FM / RDS

FM/AM

FM/AM

REMOTE KEY

45 KEY

45 KEY

DUAL VOLTAGE

O

O

SPK IMPENDANCE

4 OHM

4 OHM

Model Name

Photo

CD DVD : MX-F630DB Only

TIP O : Feature Included X : Not Included

Copyright© 1995-2013 SAMSUNG. All rights reserved.

2-3

2. Product Specification

2.4. Accessories 2.4.1. Supplied Accessories Accessories

TUNER/AUX

Item

Item code

Batteries (AAA)

4301-000116

Remote Control

AH59-02613B

User’s Manual

AH68-02677J

CD/BLU ETOOTH

FOOTBALL

AUTO CHANGE

FM/AM Antenna (Optional)

2-4

AH42-00036A

Copyright© 1995-2013 SAMSUNG. All rights reserved.

3. Disassembly and Reassembly

3. Disassembly and Reassembly 3.1. Main Disassembly and Reassembly CAUTION •

Be careful to follow the disassembly sequence described in the manual. Otherwise, the product may be damaged.

•

Be sure to carefully read and understand the safety instructions before performing any work as the IC chips on the PCB are vulnerable to static electricity.

•

In order to assemble reverse the order of disassembly. Description

1.

Description Photo

Unfasten 4 screws on the 2 side Cover. : BH 3*10 BLACK CAUTION Be careful not to make any scratches as you remove them.

Copyright© 1995-2013 SAMSUNG. All rights reserved.

3-1

3. Disassembly and Reassembly

Description 2.

3-2

Description Photo

Separate the Front panel.

Copyright© 1995-2013 SAMSUNG. All rights reserved.

3. Disassembly and Reassembly

Description 3.

Unfasten 5 screws in SMPS and detach AC-CORD & 13P shield wire. : BH 3*10 SILVER

4.

Unfasten BT screws and 2 kitting screws and detach DECK wire. : BH 3*10 BLACK

Copyright© 1995-2013 SAMSUNG. All rights reserved.

Description Photo

3-3

3. Disassembly and Reassembly

Description 5.

Unfasten 2 screws from inside, separate DECK from mecha. : BH 3*10 BLACK

6.

Unfasten 10 screws, and then Separate the front PCB from Front Panel. : BH 3*10 SILVER

3-4

Description Photo

Copyright© 1995-2013 SAMSUNG. All rights reserved.

3. Disassembly and Reassembly

3.2. DECK Disassembly and Reassembly Description 1.

Description Photo

Separate Tray - Disc from DECK.

Copyright© 1995-2013 SAMSUNG. All rights reserved.

3-5

3. Disassembly and Reassembly

Description

Description Photo

O P E N/C LO S E

HOOK

HOOK

3-6

Copyright© 1995-2013 SAMSUNG. All rights reserved.

3. Disassembly and Reassembly

Description 2.

Description Photo

Lift up Holder-Cable, separate Traverse-DECK.

HOOK

Copyright© 1995-2013 SAMSUNG. All rights reserved.

HOOK

3-7

3. Disassembly and Reassembly

Description 3.

Description Photo

Disassemble complete.

Holde r-Ca ble

Tra verse- Deck HOLDER-CHUCK

3-8

Tra y-dis c

Copyright© 1995-2013 SAMSUNG. All rights reserved.

4. Troubleshooting

4. Troubleshooting 4.1. Checkpoints by Error Mode Oscilloscope Setting Values

Normal Voltage

27 MHz

32.768 KHz

Voltage/DIV

1 Vol/DIV

1 Vol/DIV

1 Vol/DIV

TIME/DIV

1 uS/DIV

10 ns/DIV

0.1 uS/DIV

Copyright© 1995-2013 SAMSUNG. All rights reserved.

4-1

4. Troubleshooting

4.1.1. No Power No P owe r

Che ck MAIN P CB MIC1 P IN8 : 3.3V.

No

Ye s

Che ck MAIN P CB CN2001 7~8# (5.1V).

No

Che ck or re pla ce S MP S .

Ye s

Che ck MAIN P CB UCN1 9# : VF5.1V.

No

Che ck MAIN P CB VFQ1 ; VFQ2 .

Ye s

Check VFD Voltage on MAIN PCB CN2001 11~13# .

No

Che ck or re pla ce S MP S .

Ye s

(1) Che ck CLOCK circuit in MAIN P CB X1 pa rt OK? No

Ye s

Cha nge the FRONT P CB As s y.

* Re fe r to wa ve pa tte rn ima ge of Fig. 4-1.

Che ck pa tte rn or re pla ce MIC1.

4-2

Copyright© 1995-2013 SAMSUNG. All rights reserved.

UNDEFINED

(1)

MR50

10KOHM

6 5

MR49

SDA

2.2KOHM

SCL

VSS

MR48

A2

2.2KOHM

KEY_ADC2 KEY_ADC1 TU_DA TU_CLK TU_RST USB_EN USB_FLG

MP3.3V_PW

BT_RST BT_TX BT_RX

3 4

MC71 100NF

2.2KOH

4. Troubleshooting

DGND

EMULATOR OPTION SPI_DI SPI_CS3 SPI_CLK SPI_DI SPI_DO 16V

RESET

VS33PLL

MR79

33OHM

2 4 MAR7 6 100OHM 8

MC25

100NF

1 3 5 7

I2C_WP P_O N1 PWM_AM1 TI_RST

5

16V

MC24

100NF

100OHM

DAC_O1 VD33ADAC VS33ADAC VID_XI VID_XO SR[03] SPDIF_IN SR[16] SR[17] VDD AUX[3] AUX[2] OP[7] OP[6] OP[5] VSS33/VSS VD33 OP[4] OP[3] OP[2] OP[1]

26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44

VDD

M5.1V_PW

DGND

2

MC40

330UF 16V

6.3V

DGND

3 SPI_CS SPI_DI

MC23 100NF 16V

Copyright© 1995-2013 SAMSUNG. All rights reserved.

8 VCC OPTION 7 DO(IO1) MD2 30 /HOLD(IO3) 6 /WP(IO2) CLK 5 * 6.5. MAIN-3 GND /CS

DI(IO0)

MC81

DGND

MR23 0OHM

MIC4

1 2 3 4

MP3.3V_PW

MC5

DAC_O2

8.2KOH M RT9818C-42PV

P_ON2

47PF

DAC_O3

100NF 16V MC21

10UF

MIC_SENS

MR54

VD33ADAC VDD

16V

DGND

MIC5

50V

TI_SD P_ON TU_RDS VOL_DN VOL_UP

100OHM

MR28

16V

MC26

27P F

2 4 MAR6 6 100OHM 8

MR30

/RESET ,RESET

MC27

27P F

SP_3.3V

1 3 5 7

820OHM

VS33ADAC

OP[0]

MR39

100NF

MIC

MCLK

(1)

OPTION

VDDAADC

TP_RST

6.3V

LINE_IN_R3 SPI_DO

DGND 50V

MC22 100NF

33OHM 33OHM 33OHM

MC38

LINE_IN_L3 SPI_DI

TP65

GND

33OHM 33OHM 33OHM

MB1

0.01OHM

OPLCH OPRCH

16V

MR25

DGND

10UF

LINE_IN_R2 SPI_CLK

UCN1

MC39

LINE_IN_L2 SPI_CS3

33OHM 33OHM

MP3.3V_PW

1

16V

LINE_IN_R1 SPI_CS2

MIC_SIG

MC37 100NF

LINE_IN_L1 AUX[0]

10U F 6.3V

10NF 10NF 10NF

VD33AADC AUX[1]

100NF

MC30

MP1.35V_PW

CB2012UA300T

16V

X1

LINE_IN_R0 RESET_B

MC28

TUNER_L TUNER_R AUX_L AUX_R

27MHZ

LINE_IN_L0 VS33/VSS

100NF

10U F 6.3V 10U F 6.3V

MR40

VDD VD33

27KOH M

MC29 MR43 MR42

MC32 MC31

100KOHM

VD33 VDD

MR44

MC34 10U F 6.3V MAIN MC33 P CB 6.3V 10U FTop

10KOHM 10KOHM 10KOHM 10KOHM

SR[10]

MC19 16V 100NF MC20 100NF 16V

27KOH M * 5.4. 27KOH M 27KOH M 27KOH M

21 21

MC41 100NF

MR8 MR7 MR46 MR45

A3.3V_PW

MR31

SR[11] AUX[6]

10KOH M 100NF 16V 100NF 16V

MC43 MC42

MR32 MR33 MR34 MR29 MR98 MR99 MR11 MC6 MC7 MC8

SR[12] AUX[7]

MR26

33O HM OPTION

VFD_DO VFD_CE VFD_CLK VFD_DI MC78100PF MC79100PF MC80100PF

MR93

2 4 6 8

10KOHM 10KOHM 10KOHM 10KOHM

SR[00] DB[15]

100OHM

1 3 5 7

MIC 4

SR[04]

VD33PLL

SR[05]

SR[06]

SR[07]

SR[20]

SR[21]

SR[22]

SR[23]

SR[24]

SR[25]

SR[26]

VS33/VSS

SPDIF_OUT

VDD

VD33

SR[01]

204-003466

100OHM 100OHM

10KOHM

MC44

MR62

1 3 MAR9 5 7

MR68 MR67

MR72

MR75 MR74 MC46 MC45

MR19

33O HM

MAR8

88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45

MIC 3

P3CD

BOOT WITH EMULATOR

(1)

107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 SIN

SPI_CS3 SPI_CS SPI_CS2

SR[02]

SOUT

BOOT ON-BOARD FLASH

5SP_3.3V

MIC1

DB[14]

1N4148WS

5_R S

MIC 2

DB[13]

AD6

MP3.3V_PW

100NF

100OHM

2 100OHM 4 6 8

33OHM 33OHM

10KOHM

16V 16V

100NF 100NF

100OHM 100OHM

1

MIC 1

MP3.3 V MP3.3V_PW

4 6 8

1_C S3

4-3

4. Troubleshooting

4.1.2. No Output AUDIO no output

Check Menu È Music Function and Volume knob ON.

No

No

Change the function.

Ye s

Ye s

Check AIC2 (TAS5342) input signal on MAIN PCB .

Choos e the corre ct function, Or turn on the Volume .

No

Replace MIC1 on MAIN PCB. (ES8398)

No

Replace AIC2 on MAIN PCB. (TAS5342)

Ye s

Check AIC2 (TAS5342) output signal on MAIN PCB.

Ye s

Che ck L1/L2.

No

Re pla ce L1/L2.

Ye s

Che ck L1/L2 pa tte rn.

4-4

Copyright© 1995-2013 SAMSUNG. All rights reserved.

4. Troubleshooting

4.2. Measures to be taken when the Protection Circuit operates 4.2.1. Operation of Power Block Protection Circuit ■ Cases of the SMPS Protection. 1) If there is over current at the AMP IC. (Speaker Wire Short) 2) If temperature of the AMP IC is over 150 ℃. 3) There is no power supply for amp.

■ Protection Circuit operates when power problem occurs in the SMPS. Protection Location MX-H630 SMPS PCB

Pin No.

Remark Open

Short

+5.3 V (6~7#)

X

X

+PVDD (+34V) (12~13#)

X

X

12 V (9#)

X

X

P-ON (+5 V) (5#)

X

X

CNM801

Copyright© 1995-2013 SAMSUNG. All rights reserved.

4-5

4. Troubleshooting

4.2.2. Check AMP in Power Protection If you think, there are problems at the AMP Part, you can check the PCB without disassembling the set. CAUTION Do not connect the power cord during the test! Measurement Resistance using Tester R CH

2 kΩ

L CH

2 kΩ

If Measured Resistance is very different from above numbers, There is a Problem. → AMP Part Problem

2 CH S P E AK E R O U T

R IGHT

LE FT

4-6

Copyright© 1995-2013 SAMSUNG. All rights reserved.

4. Troubleshooting

4.3. MICOM, MPEG Initialization & Update ■ MPEG Version Check 1) Power On. 2) CD open status. 3) Push the number NEXT for 5 seconds, check the MICOM version. 4) Push the number PREVIOUS for 5 seconds, check the MPEG version.

■ MPEG Update 1) Insert USB Memory or Update DISC which have Update file, and play. “Update” will be displayed. 2) When finish the Set will be power off → on automatically. 3) And then the Deck is automatically open.

■ MPEG Reset 1) During “No Disc” Displayed, push the stop Button 5 seconds. After displayed “INITIALIZE” set will power off automatically.

Copyright© 1995-2013 SAMSUNG. All rights reserved.

4-7

4. Troubleshooting

4.4. Buyer-Region Code Setting Method 4.4.1. The inserting method of Region Code after replacing the Main PBA NOTE •

When replacing the Main PBA and System Micom should be inserted the region code.

•

The set is not working properly if you don't insert the region code.

•

The region code is inserted by the remote control.

1) During “AUX” status. •

MX-H630 : Push the “ENTER” button 10 Second.

2) When displayed ‘TEST”, import 46 to set the buyer.

TES T 3) When displayed ‘– – – ’, import the buyer code. The buyer setting code can find in the table named “H630 OPTION TABLE_Ver0.1”

−−− 4) It will show the buyer that you set up. Then the buyer setting is succeed.

4-8

Copyright© 1995-2013 SAMSUNG. All rights reserved.

4. Troubleshooting

Table 4.1

MX-H630 Option Table

Region Code

Buyer

00

Africa

01

Brazil

02

Latin American

03

USA, Canada

Copyright© 1995-2013 SAMSUNG. All rights reserved.

4-9

5. PCB Diagram

5. PCB Diagram 5.1. Wiring Diagram Function SPINDLE MOTOR+ SPINDLE MOTOR+ SLED_MOTORSLED_MOTOR+ OPEN SWITCH CLOSE S WITCH MOTOR GND NOT CONNECT NOT CONNECT

Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23

Signa l CD_VR CD_MPD CD_LD LD_GND SW FTT+ F+ B C D A NC NC VCC VREF GND DVD_VR P D_GND DVD_LD RF NC

Function CD circuit Adjus t APC input s igna l CD La s er control GND CD/DVD OPTION Focus driver differentia l s igna l Tra ck driver differentia l s igna l Tra ck driver differentia l s igna l + Focus driver differentia l s igna l + PD IC output s igna l PD IC output s igna l PD IC output s igna l PD IC output s igna l NOT CONNECT NOT CONNECT RF P OWER 5V

P in 1 2 3 4 5 6 7 8 9 10 11 12 13

Signa l P VDD+33V P VDD+33V S GND S GND 1.2V DGND 5.1V 5.1V P -ON VPS VFD+ VFD-VP

RF CN1 Function CD circuit Adjus t APC input s igna l CD La s er control GND CD/DVD OPTION Focus driver differentia l s igna l Tra ck driver differentia l s igna l Tra ck driver differentia l s igna l + Focus driver differentia l s igna l + PD IC output s igna l PD IC output s igna l PD IC output s igna l PD IC output s igna l NOT CONNECT NOT CONNECT RF P OWER 5V

Volta ge re fe re nce

Volta ge re fe re nce

Digita l GROND DVD VR DGND DVD La s er control RF s igna l NOT CONNECT

Digita l GROND DVD VR DGND DVD La s er control RF s igna l NOT CONNECT

CNM8 5 2

S MP S 5-1

RF CN2 Function S PINDLE MOTOR+ S PINDLE MOTOR+ S LED_MOTORSLED_MOTOR+ OPEN SWITCH CLOS E SWITCH MOTOR GND NOT CONNECT NOT CONNECT

Function GVDD P ower(+) GVDD P ower(+) GND GND Power Supply

AMP AMP AMP AMP AMP GND AMP /MP EG Power Supply AMP /MP EG Power Supply MICOM Control S MP S Signa l AMP /MP EG Power Supply VFD Power Supply(+) VFD Power Supply(-) VFD Driver IC Power Supply

UCN1 Signa l S P+ S PSLSL+ INS W OUTSW GND NC NC

Pin 1 2 3 4 5 6 7 8 9

Signa l CD_VR CD_MPD CD_LD LD_GND SW FTT+ F+ B C D A NC NC VCC VREF GND DVD_VR PD_GND DVD_LD RF NC

Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23

S igna l PVDD+33V PVDD+33V S GND S GND 1.2V DGND 5.1V 5.1V P -ON VPS VFD+ VFD-VP

Pin 1 2 3 4 5 6 7 8 9 10 11 12 13

Ma in

Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23

Signa l GND USB_DP USB_DN USB_5.2V MIC_S EN AGND MIC_S IGN AGND S T5.1V M5.1V REMOCON DGND KEY_AD1 KEY_AD2 VOL_UP VOL_DN VFD_DO VFD_CLK VFD_CE DGND VFD_VP -VFD +VFD

P in 1 2 3 4 5 6 7 8 9 10

S igna l BT_RST MP3.3V_P W BT_RXT BT_TXD GND I2C_SCL I2C_SDA GND NC NC

FCN1 Function

GND USB Differentia l Signa l USB Differentia l Signa l USB Power Supply MIC S ens or Signa l GND MIC S igna l GND REMOCON Eye P ower S upply Abov/Driver IC P ower S upply REMOCON Eye S igna l GND Key S igna l 1 Key S igna l 2 Volume Up Volume Down VFD Da ta VFD Working Clock Signa l VFD Ena ble GND VFD Driver IC Power Supply VFD P ower S upply(-) VFD P ower S upply(+)

Function GND USB Differentia l Signa l USB Differentia l Signa l USB Power Supply MIC S ens or S igna l GND MIC S igna l GND REMOCON Eye Power Supply Abov/Driver IC P ower S upply REMOCON Eye Signa l GND Key Signa l 1 Key Signa l 2 Volume Up Volume Down VFD Da ta VFD Working Clock S igna l VFD Ena ble GND VFD Driver IC Power Supply VFD P ower S upply(-) VFD P ower Supply(+)

Signa l GND US B_DP US B_DN USB_5.2V MIC_S EN AGND MIC_S IGN AGND S T5.1V M5.1V REMOCON DGND KEY_AD1 KEY_AD2 VOL_UP VOL_DN VFD_DO VFD_CLK VFD_CE DGND VFD_VP -VFD +VFD

Pin 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

B T CN1 Function BT Res et Signa l BT Power Supply BT Communica te Signa l (Receive) BT Communica te Signa l (Send) GND I2C_SCL I2C_SDA GND NOT CONNECT NOT CONNECT

Function BT Res et Signa l BT Power S upply BT Communica te Signa l (Receive) BT Communica te S igna l (Send) GND I2C_SCL I2C_SDA GND NOT CONNECT NOT CONNECT

S igna l Pin BT_RST 1 MP3.3V_P W 2 BT_RXT 3 BT_TXD 4 GND 5 I2C_S CL 6 I2C_S DA 7 GND 8 NC 9 NC 10

BT (Op tio n )

Signa l SP + SP SLSL+ INSW OUTSW GND D+ D-

Fro n t J ACK

De c k

Pin 1 2 3 4 5 6 7 8 9

CN2 0 0 1 Function AMP GVDD Power(+) AMP GVDD Power(+) AMP GND AMP GND AMP P ower S upply GND AMP/MPEG Power S upply AMP/MPEG Power S upply MICOM Control S MP S Signa l AMP/MPEG Power S upply VFD Power Supply(+) VFD Power Supply(-) VFD Driver IC Power S upply

Copyright© 1995-2013 SAMSUNG. All rights reserved.

5. PCB Diagram

5.2. FRONT PCB Top

FCN1

(1)

Copyright© 1995-2013 SAMSUNG. All rights reserved.

5-2

5. PCB Diagram

5.2.1. Pin Connection 1) FCN1 AUX/MIC/USB/VOLUME/KEY Control

5-3

Pin No.

Signal

1

GND

2

USB_DP

3

USB_DN

4

USB_5.2V

5

MIC_SEN

6

AGND

7

MIC_SIGN

8

AGND

9

ST5.1V

10

M5.1V

11

REMOCON

12

DGND

13

KEY_AD1

14

KEY_AD2

15

VOL_UP

16

VOL_DN

17

VFD_DO

18

VFD_CLK

19

VFD_CE

20

DGND

21

VFD_VP

22

-VFD

23

+VFD

Copyright© 1995-2013 SAMSUNG. All rights reserved.

5. PCB Diagram

5.3. FRONT PCB Bottom

Copyright© 1995-2013 SAMSUNG. All rights reserved.

5-4

5. PCB Diagram

5.4. MAIN PCB Top

UCN3

(5)

R F IC 2

CN2 0 0 1

MIC 1 AIC 2

MIC 2

(1)

5-5

(4)

MIC 3

UCN1 RFCN2

(2)

MIC 4

RFCN1

TP1

B TC N 1

(3)

Copyright© 1995-2013 SAMSUNG. All rights reserved.

5. PCB Diagram

5.4.1. Pin Connection 1) RFCN1

3) UCN1

Deck Control (Focus / Data)

4) BTCN1

FRONT Panel Control

BT control

Pin No.

Signal

Pin No.

Signal

Pin No.

Signal

1

CD_VR

1

GND

1

BT_RST

2

CD_MPD

2

USB_DP

2

MP3.3V_PW

3

CD_LD

3

USB_DN

3

BT_RXT

4

LD_GND

4

USB_5.2V

4

BT_TXD

5

SW

5

MIC_SEN

5

GND

6

F-

6

AGND

6

I2C_SCL

7

T-

7

MIC_SIGN

7

I2C_SDA

8

T+

8

AGND

8

GND

9

F+

9

ST5.1V

9

NC

10

B

10

M5.1V

10

NC

11

C

11

REMOCON

12

D

12

DGND

13

A

13

KEY_AD1

14

NC

14

KEY_AD2

Pin No.

Signal

15

NC

15

VOL_UP

1

PVDD+33V

16

VCC

16

VOL_DN

2

PVDD+33V

17

VREF

17

VFD_DO

3

SGND

18

GND

18

VFD_CLK

4

SGND

19

DVD_VR

19

VFD_CE

5

1.2V

20

PD_GND

20

DGND

6

DGND

21

DVD_LD

21

VFD_VP

7

5.1V

22

RF

22

-VFD

8

5.1V

23

NC

23

+VFD

9

P-ON

10

VPS

11

VFD+

12

VFD-

13

-VP

2) RFCN2 Deck Open / Close Control Pin No.

Signal

1

SP+

2

SP-

3

SL-

4

SL+

5

INSW

6

OUTSW

7

GND

8

NC

9

NC

Copyright© 1995-2013 SAMSUNG. All rights reserved.

5) CN2001 VFD / CD Voltage Supply

5-6

5. PCB Diagram

5.4.2. Test Point Wave Form TP1

5-7

Copyright© 1995-2013 SAMSUNG. All rights reserved.

5. PCB Diagram

5.5. MAIN PCB Bottom

Copyright© 1995-2013 SAMSUNG. All rights reserved.

5-8

5. PCB Diagram

5.6. SMPS PCB Top

(1)

Z ! T O P ! S IL K

C N M8 5 2

Comply with the thresho ld of substances which are specified in 0QA_209

5-9

Copyright© 1995-2013 SAMSUNG. All rights reserved.

5. PCB Diagram

5.6.1. Pin Connection 1) CNM852 VFD/CD/AMP Voltage Supply Pin No.

Signal

1

PVDD+33V

2

PVDD+33V

3

SGND

4

SGND

5

1.2V

6

DGND

7

5.1V

8

5.1V

9

P-ON

10

VPS

11

VFD+

12

VFD-

13

-VP

Copyright© 1995-2013 SAMSUNG. All rights reserved.

5-10

5. PCB Diagram

5.7. SMPS PCB Bottom

5-11

Copyright© 1995-2013 SAMSUNG. All rights reserved.

6. Schematic Diagram

6. Schematic Diagram 6.1. Overall Block Diagram • The Main Mpeg IC is ES8398ASA. SDRAM IC is M12L64164A. AMP IC is TAS5342.

• The Main Mpeg control each IC in this PCB.

0

DVD/CD Engine

DP - 31 Mecha

Then MPEG IC encode them and sent them to AMP IC.

2M Flash (DVD)

Key

Control P T6315A VF D Driver

ES S_P3C (8398)

0

POWER

MP EG Chip

FM /AM

F u nction In put ADC

AUX

S MPS

USB HOST iP OD over us b

0

USB

VFD

0

64MB DRAM

• This signal go to the Crystal Amplifier(TAS5342). And amplified signal is Low Pass Filtered. This signal is real audio signal.

Tuner Control

F ront E nd

0 0

8K - EEPROM

• Audio signal is come from CD Mecha, TUNER, AUX, MIC, BT.

AM5766 Motor Drive

0

Au dio De c oder P WM

Control

TI AMP ÿ 630 ÿ

FL FR

Mic AMP

Copyright© 1995-2013 SAMSUNG. All rights reserved.

6-1

6. Schematic Diagram

6.2. FRONT AH07-00271A UNDEFINED

POWER

JTP 1280 A6

JTP 128 0A6

JTP 128 0A6

UNDEF INED

FSW11

UNDEF INED

UNDEF UNDEFINED INED

FKR14

UNDEF INED

VFD_GND

1G P21 P20 P19 7G P18 P17 6G P16 P15 P14 5G

P13 P12 P11 4G P10 P9 P8 3G P7 P6 2G P5 P4 P3 P2 P1

F+ F+

30 29 28 27 26 25 24 23 22 21 20 19

18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3

2 1

FVC7

TP3

UNDEF INED TP7

JTP 1280 A6

12800A6 A6 JTP 128

50V 10UF

100NF 50V

FF-

32 31 10UF 50V

FVC6

FVR1

1/8W 3.3KO HM

1/8W 2.2KOHM FKR13

FSW16

1/8W 1.8KOHM FKR12

JTP JTP 1280A 128 0A6 6

FSW10

FSW9

1/8W 1.5KOHM FKR11

FSW15

UNDEF INED

JTP 1280 A6

1/8W 1.2KOHM FKR10

FSW14

UNDEF INED

JTP 128 0A6

1/8W 1KOHM FKR9

FSW13

UNDEF INED

1/8W 820OHM FKR8

FSW12

KEY_AD2

FVC3

1/2W 1OHM

VFD-

FVC4

100NF 50V

FVFD

VFD+ TP21 TP12

USB

USB USBREC REC

OPEN/GLOSE OPEN/GLOS E

GIGA GIGA

PARTY PARTY

VFD_GND TP22

DEMO DEMO

TP13

FVC2

DGND

TP30

TP23 TP14

TP35 TP24

TP31

TP15

100UF 16V

TP25

TP37

TP26

10UF 50V

TP33

TP17

TP38

TP27

TP34

TP18

FVC1

TP36

TP32

TP16

TP39

TP28 TP19 TP29 TP20

STO P

1/8W 1.5KOHM FKR4

1/8W 1.8KOHM FKR5

1/8W 2.2KOHM FKR6

JTP 128 0A6

JTP 1280 A6

JTP 128 0A6

JTP 128 0A6

EQ

MP3/CDD MP3/C

UNDEF INED

UNDEF INED

POWER POWER

VFD_GND

FKR7

UNDEF INED JTP 1280 A6

TURNER

AUX AUX

1G P21 P20 P19 7G P18 P17 6G P16 P15 P14 5G P13 P12 P11 4G P10 P9 P8 3G P7 P6 2G P5 P4 P3 P2 P1

UNDEF INED

FSW8

UNDEF INED

JTP 128 0A6

REW REW

1/8W 3.3KO HM

1/8W 1.2KOHM FKR3

FSW7

UNDEF INED

FSW2

JTP 1280 A6

FSW1

JTP 1280 A6

1/8W 1KOHM FKR2

FSW6

UNDEF INED

FSW5

1/8W 820OHM FKR1

FSW4

UNDEF INED

FSW3

KEY_AD1

DELETE DELETE

DGND

DGND

OPEN

1G 2G 3G 4G 5G 6G 7G P21 P20 SG14/KS14

FVIC1

CLK

SG13/KS13 SG12/KS12

K1

SG11/KS11 SG10/KS10 SG8/KS8

K2

SG9/KS9

STB

P19 P18 P17 P16 P15 P14 P13 P12 P11 P10

-VP

VCC1

10UF 50V

100NF 50V

SG21/GR8

SG22/GR7

SG23/GR6

SG20/GR9

SG24/GR5

GR4

GR3

GR2

GR1

DIN

33 32 31 30 29 28 27 26 25 24 23

VCC2

FUJ1

SG15/KS15

SG7/KS7

MGND2

VDD

44 43 42 41 40 39 38 37 36 35 34

100OHM 1/8W 100OHM 1/8W 100OHM 1/8W

SG16/KS16

PT6315A

DOUT

VSS

USB_5V USB_DN USD_DP DGND

OSC

SG6/KS6

1 2 3 4

FVR9 FVR10 FVR11

VFD_DT VFD_CLK VFD_CE

MGND1

VSS

FVC10

FVR8

VEE

SG5/KS5

FUC5

1/8W 470O HM

LED4

SG4/KS4

10NF 50V

1/8W

SG17/GR12

SG3/KS3

47NF 50V

51KOHM

SG19/GR10 SG18/GR11

LED3

SG2/KS2

100NF 50V

FUC4 FUC4

LED2

SG1/KS1

FUC3 FUC3

LED1

12 13 14 15 16 17 18 19 20 21 22

FMC6

50V 47NF

FMR7

1/8W 22KOHM

75 1N4148 FMD2

FMD1

FUC2

1 2 3 4 5 6 7 8 9 10 11

VDD

FMQ1

FMB3

FVC8

16V 220UF

4.3 GDZJ4.3B

50V 1UF

FMC4

FMR5

2SC1008- Y

75 1N4148

UNDEFINED

UNDEF INED 3857ST

470U F 470UF 10V

E

FMR4

FMR1

1/8W 10KOHM

C B

100NF 50V

MIC_SIG

11160-204136-01

VFD_GND DGND

MGND

MIC_AGND1

P1 P2 P3 P4 P5 P6 P7 P8 P9

16V 10NF

FMR2

OR3

50V 1UF

FMC2

1/8W 220O HM

FMC3

AT12535250C01

1/4W 100O HM

MGND

VFD_GND

DGND

FUC1

1/8W 33OHM

FMJ1

1/8W 100KOHM

50V 1UF FMC1

7 6 2 3 4 5 1

1/8W 2.2KOHM

UNDEF INED 3857ST

FMR3

FMB1

FMC5

MIC_SEN

UNDEFINED

FMD3

10V 220UF

VFD_GND

5.1V

DN_VOL

FVC9

FMB2

5.1V

UP_VOL

100NF 50V

FMR6

UNDEF INED 3857ST

1 3 MGND2 2

1N4148 75

1/8W 220O HM

UNDEFINED EVEKD2F3024M

UNDEFINED

FVD3

5.1V

FVOL

MGND1

DGND

DGND

T8 T8

T9 T9

T10

T11 T12 T13 T13 T14 T14 T15 T15 T16 T16 T17 T17 T18 T18 T19 T19

U1 U2 U3 U3 U4 U4

DGND USD_DP USB_DN USB_5V MIC_SEN MGND MIC_SIG MGND 5.1V R5.1V REMOCON DGND KEY_AD1 KEY_AD2 UP_VOL DN_VOL VFD_DT VFD_CLK VFD_CE VFD_GND -VP VFDVFD+

C1

50V 1NF

VFD_GND

R5. 1V

C4

MGND

DGND

50V 1NF

1

FRR2

2

FRR1

C2

C3

1/8W 22O HM

REMOCON R5.1V

50V 1NF

47OHM 1/8W

FRC1

T7 T7

FRD2

T6 T6

UZ5.6BSB 5.6

T5 T5

FRD1

T4

50V 10UF

3 FRC2

100NF 50V

OUT VCC GND

MGND1

MGND2

KSM-913TE5

FCZ100E-23SS-K

T3

REMOCON

23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

UGND D_P D_N U5.4V MIC_SEN MGND MIG_SIG MGND 5.1V R5.1V REMOCON DGND KEY_1 KEY_2 JOG+ JOGVFD_DO VFD_CLK VFD_CE DGND VPVFDVFD+

T2

5.6 UZ5.6BSB

T1

DGND 50V 1NF

DGND

DGND

FCN1

6-2

Copyright© 1995-2013 SAMSUNG. All rights reserved.

6. Schematic Diagram

TU_RDS

6.3. MAIN-1 POWER

NR01 0OHM FM

TUR7

DFS

AM_G 470NF 25V

2

Q1

Q2

3

4730 US E

DGND

DGND

TUC19

FMRF

TUC18

TUR18

FM_RDS 0OHM

12

AM

TU3.3V_PW

2 4 6 8

4

TUR2

TUC1 0

10UF 10V

TUR4

33KOHM

TUR3

33KOHM

TUC2

DGND

22PF

TUC3

100OHM

MP3.3V_PW

TUR1 5

0OHM DGND

TUR17 100OHM 1

Q3

22PF 50V

Q0

22PF 50V

1

TUNER_L TUNER_R

22PF

VIO

RCLK

6 7 8 9 10

SDIO

SCLK

DGND VDD

100OHM

FM 47UF

GND

6.3V

GPO3/DCLK

GPO1

ROUT

/RST

AM

TUC1 5

AM

3 2 1

DGND

LOUT

TUR1

TUC9

10UF 10V

TUC5

LPI

0OHM

15 14 13 12 11

TUC12 100NF

RFGND

TUX1 32.768HZ

AM_S

ANT1

GPO2/INT-

NC

FMI

TUR9

DOUT

MGND1

NC

/SEN

100NH

TL1

TUC17 2PF 50V

100OHM

AM

TUR6

1 2 3 4 5

10PF

12

MGND2 MGND1

MGND3

C3004 100NF

220UF

C3005

TUC16

DGND

VT4002

ESDC2

DGND

470NF 50V

50V

ESDC1

VFD+ VFDVP470NF

12V SGND PVDD+33V P33V

ECO 5.1V GND

VFD+ GND11

P_ON

20 19 18 17 16

TIC1 FMRF

M5.1V_PW 0.01OHM

VT4001

PBD3

VFD-

10KOHM 1/16W

TP2002 5.1VA P12VA P12V

FM_S

FMJ1

3 5 7

SGND_A P33VA PVDD+33V_A

PVDD+33V_PW

+12V_A_PW

-28V

SCB-1113-00-2

MAIN-SMPS PCB

1 2 3 4 5 6 7 8 9 10 11 12 13

PVDD+33V PVDD+33V SGND SGND 12V DGND 5.1V 5.1V ECO VPS VFD+ VFD-28V

TU3.3V_PW

1

CN2001

GND1A

-28V_A -28VA VFD-_A VFD-A VFD+A VFD+_A GNDA ECOA ECO_A

AUDIO

2 4 6 8

1 3 5 7

TUR16 10KOHM

TIC1

OPTION FM AM

4730 OMIT

1204-003345

RDS

4705

OMIT

OMIT

NR01 0 OHM

10KOHMOMIT OMIT

0 OHM OMIT

USB5V_PW

M5.1V_PW

TP2001 U12A U13A U14A U15A U5A U6A U7A U2A U17A U18A U19A

U11A

1204-003347

TUR18 TUR6 0 OHM OMIT

VFD_CE VFD_CLK VFD_DO

VOL_DN TPTX

M5.1V_PW

UQ2

10KOHM

UR2

47KOHM

UR1

2 3 1 TPRX DGND

UR6

100NF

47KOHM

U11

U10 U12 U13 U14 U15 U5 U6 U7 U2 U17 U18 U19

U1 U3 U8

UART_TX

C B E

P_O N1 UQ1

DTC114EU DGND

Copyright© 1995-2013 SAMSUNG. All rights reserved.

UR4

USB_DN USB_DP

UC2

MIC_S ENS 33OHM 33OHM

UR7

UC1

G

MIC_SIG 100OHM

100KOHM

11UF UF 116V 6V

S

UR5

UR3

5 4

AO3415AS D

REMOCON_IN

UCN3

UART_RX

GCC02-0096

VOL_UP KEY_ADC2 KEY_ADC1

U_GND DP DN USB5

MAIN-FRONT PCB

UCN1

SPEC TUR9 4702 0 OHM

VFD+ VFDVP-

23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

USD1

VFD+ VFD-28V DGND VFD_CE VFD_CLK VFD_DO JOGJOG+ KEY_AD2 KEY_AD1 DGND REMOTE 5.1V 5.1V AGND MIC_SIG AGND MIC_SENS USB5.2V D_N D_P GND

U1A U3A U8A

U_GND_ DP_ DN_ USB5V

1204-002700

TU_RST TU_CE TU_CLK TU_DA

DGND

DGND

6-3

6. Schematic Diagram

MP3.3V_PW

100P F RFC 1

VD5

1/16W

1/16W

3.3KOHM

RFR20

OPTION

VD6

OPTION

220PF

AUC5L

AUC5R

220PF AUR7R 47KOHM

AUR7L 47KOHM

RFR23

1/16W

1/16W

10KOHM

RFR21

10KOHM

RFR22

RFR18

1/16W

1MOHM

1/16W

RFC14 100NF 10V

RFR14

1/16W

4.7KOHM

22KOHM

680OHM

VJK2

30KOHM

2.2NF

33NF

MPC11

MPR4 MPC38.2KOHM

1/10W

MPR15 47KOHM

MPC2

10KOHM

10UF 10V

MPR3

10UF 10V

MPC1

SPMOP SPMON SLED_N SLED_P INSW OUTSW RFGND DCLOAD_P DCLOAD_N

MPR5

22O HM MPBD5

0.01OHM

MPC13 100NF

EN

6.3V

SS

COMP

47UF

FB

MPBD1

MPC12

TP1 TP2 TP3 GND1 TP5 TP6 TP7 TP8 TP9 TP10 TP11 TP12 TP13 TP14 TP15 TP17 TP22

LX

AGND

0.01OHM

MPR14

VIN

A3.3V_PW

MPBD4 MP3.3V_PW

MPL2

4.7UH

8 7 6 5

NC

RFR 50

33OHM

P_ON2 3.3C 12 12

2.2OH M

1/8W

RFR41

SPMO_P

RFC16

10UF 10V

DGND DM5V_PW

MPC14 100NF

47UF

MPC86.3V

MPR11

3.3KOHM

33NF 16V

1/10W

MPR9

8.2KOHM

MPC6

2.2NF

MPR8

USB_EN USR1

10KOHM

IN GND EN

OUT ILIM /FAULT

6 5 4

USB_FLG

DGND

1/16W

10KOHM

MPR13

G

11UF UF 116V 6V

S

D

330UF 16V

RFC15

1/10W

10KOHM

MPC5

1 2 3

DGND

RFR 36

MPQ3

USB5V_PW

USIC1

1/16W

2.2OH M

AO3415AS

50V

10UF 10V

DGND M5.1V_PW

C3003 100NF

TRACK_N TRACK_P

1/16W

DGND

USC3

RFR 37

MPBD3

0.01OHM

10UF 10V

SPMO_N

RFR RFR40 40

1.2KOHM

16.5KOHM

VOFC+

RFR 44

22KOHM

RFR 39

10KOHM

1/10W

USR3

VOFC-

1/16W

3.6KOHM

OPOUT

10KOHM

VOS L-

SPINDLE

USC2

VOS L+

1KOHM

1/16W

10UF 10V 10UF 10V

VOTR+

RFR 42

1KOHM

RFR 45

USC1

VOTR-

1/16W

1/16W

Vcc1

TRACK

27KOHM

REV

1/16W

RFR 46

39KOHM

1/16W

FWD

1/16W

RFR38

REGO1

BIAS

1/16W

M5.1V

MPC10

VINSL+

28 27 26 25 TRB_2 24 OPOU T 23 VINLD 22 GND 21 VCTL 20 OPIN 19 Vcc2 18 VOLD17 VOLD+ 16 VOTK15 VOTK+ MUTE

VINTK

1/8W

10KOHM

1/16W

10KOHM

RFR34

SLED_N SLED_P FOC US_N FOC US_P

REGO2

3.3KOHM

CLOSE OPEN

TRB_1

RFR43

1/16W

VINFC

1MOHM

SLEGN

1 2 3 4 5 6 7 8 9 10 11 12 13 14

1KOHM

1/16W

6.8KOHM

10UF 10V

DRV

MGND1

RFR 33

MPC4

3.3KOHM

RFR 47

MGND2

1/16W

MPR10

MPIC2

MPC7

RFR 49

MP1.35V_PW

0.01OHM

1/10W

8 1 PGND NC 2 VIN 7 SS 3 AGND LX EN 6 4 FB 5 COMP

33OHM

RFR 48

MPBD2

MPL1

4.7UH

MGND1

M5.1V_PW

USR2

RF_1 RF_2 RF_3 RF_4 RF_5 RF_6 RF_7 RF_8 RF_9 FOC US

DGND

MPR6 1KOHM

10KOHM

33OHM

DGND

CLOSE_SW

RFR53

47KOHM

RFR52

RFR 51

47KOHM

RFC12

RFC11 100NF

100NF

OPEN_SW

MPR7

SPMO _P SPMO _N SLED_N SLED_P

22KOHM

RFR35

2.2KOHM

MPIC1 PGND

1.1KOHM

MPC9

10UF

MPR2

47KOHM

1 2 3 4

MGND1

RFIC2

MPR12

RFR16

1/16W

RFR17

DVDLD DVDVR D_LD D_VR

M5.1V_PW

RFR 32

1/16W

4 2 3 1

12 12

DA

100KOHM

AUXI_L AUXI_R

MPR1 10KOHM

CDLDO MPD CDVR

100NFF 10V 100N

C

P_O N

AUXR AUXL AUXL

DGND

A D C B FOC US_P TRACK_P TRACK_N FOC US_N SW

RFC 17

P_ON

DGND

DGND

DGND

DGND

M5.1V_PW

1/16W

18KOHM

MVREF

1 2 3 4 5 6 7 8 9

10022HS-09C

SP+ SPSLSL+ INSW OUTSW GND NC NC

1/16W

TG1 TG2 TG2 TG3 TG3 TG4 TG4

10UF

DGND

RFCN2

RFR15

1KOHM

RFR19

1/16W

10KOHM

RFC6

RF5V RF5V_

RFQ1

RFC5

1NF 50V

RFR4

1/16W

0.2O HM

AUXI_L

AUX_L

8 7 6 5

47KOHM

EMC2

RFD2

EMC1

10UF

OUT1 VCC IN1OUT2 IN1+ IN2GND IN2+

CDLDO

PUHRF 15PF

RFC 2

22O HM DGND

RFC20 100NF 10V

EMCBD1

CDLD

RFR 3

220OHM

1NF 50V

RFR 31

330UF

23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

NC RF DVD_LD PD_GND DVD_VR GND VREF VCC NC NC A D C B F+ T+ TFSW LD_GND CD_LD CD_MPD CD_VR

RF1 RF2 RF3 FRGND RF5 RF6 RF7 RF8 RF9 RF10 RF11 RF12 RF13 RF14 RF15 MVRER PUHRF

RFC 3 (NC)

RFC N1

SW A B C D CDVR

100P F 100P F 100P F 100P F 100P F

C

RFC1 8 RFC7 RFC8 RFC9 RFC1 0

E

DM5V_PW DM5V_PW

RFBD1

0.01OHM

1 2 3 4

AUXI_R AUR6L 220O HM

RFIC1

1/16W B

RF5V_PW

RFR2

RFC4

RFR 28

10KOHM

AUR6R 220O HM AUX_R

C3002 100NF 10V

22UF 6.3V

RF5V_PW

1/4W

RFR1 4.7OHM

RF5V_PW

EMC IMPRO VE

SPMO_P

MOCTL

POWER

SPMO_N

6.4. MAIN-2

B E

MPQ4

DTC114EU

DGND

6-4

Copyright© 1995-2013 SAMSUNG. All rights reserved.

RESET I2C_SCL I2C_SDA SPI_CS2 SPI_CS3 SPI_CLK SPI_DI SPI_DO SPI_CS

UART_RX UART_TX

DB12 DB13 DB14 DB15

DB8 DB9 DB10 DB11

DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

100OHM 100OHM

33OHM 33OHM 33OHM 33OHM 33OHM 33OHM

MR16 MR17 MR18 MR20 MR21 MR22

MR24 MR91 MR92 10KOHM 10KOHM 10KOHM

DMA[8]

DMA[3] OP[7]

VD33 OP[6]

VDD OP[5]

DMA[2] VSS33/VSS

DMA[1] VD33

DMA[0] OP[4]

50V

100PF

16V

2 4 MAR7 6 100O HM 8

MC25

1 3 5 7

MIC5

RT9818C-42PV VDD

MC23 100NF

100NF

MR30

100O HM

MC24 100NF

MR28

100O HM

MP3.3V_PW

MR25

8.2KOHM M5.1V_PW

100NF

33O HM

5

16V

DGND

I2C_WP P_ON1 PWM_AM1 TI_RST

16V

16V

DGND

27PF

2 4 MAR6 6 100O HM 8

GND

SPI_CS SPI_DI

1 2 3 4

16V

DGND

MP3.3V_PW

50V

27PF

MC27

6.3V

MC39

330UF 16V

MC40

6.3V

10UF

S

D

100NF 100PF

16V 16V

MR79

100NF

16V

100OHM

2 100OHM 4 6 8

33OHM 33OHM

10KOHM

100NF 100NF

100OHM 100OHM 100OHM

100OHM

100PF

BTR1 BTR2 4.7KOHM

16V

100OHM

BTC6 100PF

100PF BT8B BTC7 BT7B BT1B BT4B BT5B BT6B 4.7KOHM

FE TE 4.7NF 50V 1NF 50V 100NF 16V

10KOHM 22NF 25V

50V

1NF 50V 100PF

470KOHM

10KOHM

MC44

MR62

1 3 MAR9 5 7

MR68 MR67

MR72

MR76 MR75 MR74 MC46 MC45

MR80

MC13

MR82

MC47 MC11

MC50 MC49 MC48

MR84 MC52

MC55 MC54

MR85

BR3 1/16W

100KOHM

BTC8

G

1UF 16V

5SP_3.3V

MC38

10UF

16V

MIC_SIG MC37 100NF

TUNER_L TUNER_R AUX_L AUX_R MC41 100NF

MC78100PF MC79100PF MC80100PF

AGC1

SPNN

132 131 130 129 AGC2 128 VBO 127 CDLD 126 REX 125 PI 124 V165O 123 FE 122 TE 121 MB 120 DB 119 MP 118 VGB 117 VPB 116 OPEN/VOBS 115 OPENSW 114 CLOSE/VOBS1 113 CLOSESW 112 AMPSTBY 111 SR[31] 110 SR[30] 109 AUX[4] 108 AUX[5] 107 SOUT 106 SIN 105 VDD 104 VD33 103 VS33/VSS 102 SPDIF_OUT 101 SR[26] 100 SR[25] 99 SR[24] 98 SR[23] 97 SR[22] 96 SR[21] 95 SR[20] 94 SR[07] 93 SR[06] 92 SR[05] 91 SR[04] 90 VD33PLL 89 VS33PLL SPNP

MC61

10KOHM 1/16W

BR4

DTC114EU

BTC5100NF

10UF

BTC3 15PF BTC4

MP3.3V_PW

DGND

/CS

VCC DO(IO1) /HOLD(IO3) /WP(IO2) CLK GND DI(IO0)

MC5

DMA[11] AUX[2]

MGND2

MC57

MC51

100PF

50V

10PF

1

MC9

47PF

MC83

100NF

10KOHM

MR71

MR70

10KOHM

10UF 6.3V

MC82

MC53

MC56 100NF

10UF

KEY_ADC2 KEY_ADC1 TU_DA TU_CLK TU_RST USB_EN USB_FLG

MP3.3V_PW

MR50A 2.2KOHM

REMOCON_IN BT_RST BT_TX BT_RX

CLOSE_SW DRV

OPEN_SW

MP3.3V_PW

MIN DA

MVREF CDLD

MOCTL

SPI_DI

3 MIC4

8 7 6 5 MD2

DGND

10KOHM

MR50

MR49

2.2KOHM

2.2KOHM

MR48

MC71 100NF

UNDEFINED

47PF

1 3 5 7

MIC3

4SP_DO 2SP_CLK

DMA[9] AUX[3]

BTC215PF

MP3.3V MP3.3V_PW

SP_3.3V

MC28

33O HM 33O HM

SDA

MC81

10UF 6.3V

SCL

VSS

100NF

MC30

100NF

WP

A2

MR54

27KOHM

MC29 MR43 MR42

X1

MR44

6.3V 6.3V 6.3V 6.3V

27MHZ

10UF 10UF 10UF 10UF

10NF 10NF 10NF

VS33/VSS SR[17]

MR39

MR40

MC34 MC33 MC32 MC31 A1

8 7 6 5

820OHM

MC22 100NF

27KOHM 27KOHM 27KOHM 27KOHM

21 21

2 4 6 8 VCC

OPTION

/RESET,RESET

10KOHM 100NF 16V 100NF 16V

100KOHM

MR8 MR7 MR46 MR45

MR31

MR93

10KOHM 10KOHM 10KOHM 10KOHM

VDD

OP[0]

MCLK

SPI_DO

SPI_DI

SPI_CLK

SPI_CS3

SPI_CS2

AUX[0]

AUX[1]

RESET_B

VS33/VSS

VD33

VDD

AUX[6]

AUX[7]

DB[15]

DB[14]

DB[13]

DB[12]

MC43 MC42

MR32 MR33 MR34 MR29 MR98 MR99 MR11 MC6 MC7 MC8

DRAS1_B OP[1]

VS33/VSS

VD33

DB[11]

DB[10]

DB[9]

DB[8]

VDD

DB[0]

DB[1]

DB[2]

DB[3]

DB[4]

DB[5]

DB[6]

DB[7]

50V

MAR8

100O HM

A0

SP_GND

DGND

1

1 3 5 7

10KOHM 10KOHM 10KOHM 10KOHM

DRAS2_B OP[2]

VS33/VSS

VD33

DQM

VDD

DSCK

DWE_B

DCAS_B

MIC1

88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45

1 2 3 4

SP_CS

100NF 16V MC21

TP_RST

MC19 16V 100NF MC20 100NF 16V

16V

MC18 100NF

16V

MC17 100NF

MC15

16V

100NF MC14 100NF

DMA[10] OP[3]

DRAS0_B

DCS0_B

DMA[7] SR[16]

BTC1 100NF

MP3.3V_PW

2

16V

68OHM

MR12

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44

DMA[6] SPDIF_IN

12507HS-H10M

POWER

3SP_DI

50V

MC16

15PF

MR14 MR15

2 4 6 8

1 MAR5 3 100OHM 5 7

2 4 6 8 2 4 6 8 2 4 6 8

100OHM

MAR2

MR13

33OHM

2 4 6 8

1 MAR4 3 100OHM 5 7

1 3 5 7 1 MAR3 3 100OHM 5 7

MAR1

PLL3 PLL2 PLL1 PLL0 100OHM

MP1.35V_PW

DQM

1 3 5 7

M12L64164A-5T VDD

33OHM

CS0# RAS0# CAS# DWE# DSCK

SYSC LK SR[03]

MR6

VD33

4.7KOHM

DMA[5] VID_XO

MR5

DMA[4] VID_XI

4.7KOHM

USB_CP

PLL0 PLL1 PLL2 PLL3 OTP S_P_OPT

USB_AGND

MP3.3V_PW

33OHM VS33ADAC

MR4

16V

VD33ADAC

4.7KOHM

100NF

DAC_O1

MC4

MR95 MR96 100NF

VDD

15PF

16V USB_DM

MR3

MC75 MC76

1204-003466

DAC_O2

4.7KOHM

MA4 MA5 OPOUT MA6 MA7 16V

DVCC

S_P_O PT OTP 100NF

USB_VCCA

MC3

MC74

P3CD DAC_O3

15PF

16V

AVS33

MR2

DGND AVD33

4.7KOHM

MA8 MA9 MA11 MA3 100NF

TRO

MC2

MC72

REFD

15PF

16V

LINE_IN_R3

MR1 MA2 MA1 MA0 MA10 RAS2# RAS1# 100NF

SLO

4.7KOHM

25V

MC66

10NF

16V

100NF

MC70

CDPD

MC1

10UF MC69 LINE_IN_L3

15PF

50V

MC65

470NF

MP3.3V_PW

6.3V

FOO

100NF 10V

25V

MC64

10NF

MC63

470NF

16V

LINE_IN_R2

MC77

MA11 MA9 MA8 MA7 MA6 MA5 MA4

DQM DSCK

MPD

DMO

C76

16V

LINE_IN_L2

DQM DWE# CAS# RAS0# CS0# RAS1# RAS2# MA10 MA0 MA1 MA2 MA3

DB8

DB10 DB9

100NF 100NF LINE_IN_R1

DB7

MP3.3V_PW

MC68

MC62 LINE_IN_L1

DB5 DB6

DB12 DB11

1.2KOHM 1KOHM 1.2KOHM 1KOHM

F

NORMAL MODE TEST MODE S_P_OPTION NORMAL MODE TEST MODE MC67

100P F

SLV

DGND 4.7KOHM

MR90

MC10

VD33AADC

C75

MR86 MR87 MR88 MR89 50V

E

DB3 DB4

DB14 DB13

MVREF MIN

680P F

MIN

DB1 DB2

DB15

BT OPTION MC60

133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 LINE_IN_R0

C74

54 53 52 51 50 49 C79 100NF 10V 48 47 46 45 MC12 44 43 42 41 100NF 10V 40 39 38 37 36 MR47 35 4.7KOHM 34 33 32 31 30 29 28 DGND

P_O N2 PUHRF A B C D 16V

D

VSS DQ15 VSSQ DQ14 DQ13 VDDQ DQ12 DQ11 VSSQ DQ10 DQ9 VDDQ DQ8 VSS NC UDQM CLK CKE NC A11 A9 A8 A7 A6 A5 A4 VSS B

6.3V

VD33ADAC

VDD DQ0 VDDQ DQ1 DQ2 VSSQ DQ3 DQ4 VDDQ DQ5 DQ6 VSSQ DQ7 VDD LDQM /WE /CAS /RAS /CS A13 A12 A10/AP A0 A1 A2 A3 VDD E

100NF

LINE_IN_L0

CLK SOURCE CRYSTAL DCLK INPUT

MC58

VS33ADAC

1 2 3 4 5 6 7 8 100NF 9 10V 10 11 12 13 100NF 14 10V 15 16 17 18 19 20 21 22 23 24 25 26 27 C

MC59

C

Copyright© 1995-2013 SAMSUNG. All rights reserved. PL3 0 1 OTP 0 1 S_L 0 1 BQ2

VDD

FRE Q N/A 121.5 128.25 135 141.75 155.25 162 148.5

10UF

B

0.2O HM

VD33

PLL0 MULTI 0 0 BYPASS 1 0 4.5 0 4.75 5.0 1 5.25 0 1 5.75 1 6.0 0 5.5 1 BTBD1

A

PLL1 0 0 1 1 0 0 1 1

BT_RST

SR[10]

0.01OHM

SR[11]

BTBD4

MP3.3V_PW

MIC

100NF 10V 100NF 10V

SPINDLE FOCUS SLEG N TRACK AO3415AS

BQ1

VGA

0.2O HM

SR[12]

BTBD3 0.2O HM

I2C_SDA I2C_SCL BT_TX BT_RX

VPA

C73

USB_DN USB_DP

33O HM 33O HM

DRFP

PLL2 0 0 0 0 1 1 1 1 BR2

SR[00]

BR1 BTBD2

SR[01]

10 9 8 7 6 5 4 3 2 1 MGND1 MP3.3V_PW

VDDAADC

AUDIO

SR[02]

BTCN1

BT3

BT2

DB0 BT16 BT5 BT4 BT1 BT7 BT8

MIC2

6. Schematic Diagram

6.5. MAIN-3 MP3.3V_PW

DGND I2C_SDA

I2C_WP I2C_SCL

EMULATOR OPTION 1_CS 3

SPI_CS3 SPI_CLK SPI_DI SPI_DO RESET 1N4148WS

AD6

BOOT ON-BOARD FLASH

5_RS

SPI_CS3 SPI_CS

33O HM

MR19

BOOT WITH EMULATOR

SPI_CS2

33O HM OPTION

MR26

VFD_DO VFD_CE VFD_CLK VFD_DI

A3.3V_PW

CB2012UA300T

MP1.35V_PW

MB1

0.01OHM

OPLCH OPRCH TP65 DGND

MC26

TP 1

50V

TI_SD P_ON TU_RDS VOL_DN VOL_UP

16V

MIC_SENS P_ON2

MR23 0OHM

MP3.3V_PW

OPTION

30 SPI_CLK SPI_DO

DGND

6-5

6. Schematic Diagram

6.5.1. Test Point Wave Form TP1

6-6

Copyright© 1995-2013 SAMSUNG. All rights reserved.

6. Schematic Diagram

6.6. MAIN-4 POWER

PVDD+33V_PW

APR4

1/10W 10KOHM

AUDIO

100KO HM 1/10W E

APQ1

APR2

B C

5.6

APD1

APD2

M5.1V_PW

TI_RST

APR3

SRA2203S

0OHM 1/10W

BAT54C 30

DGND

SRC1203S

C B E

AMP MUTE CIRCUIT

APQ2

R-

DGND

PVDD+33V_PW

NC NC VDD GVDD_C

OUT_ D OUT_D PVDD_ D PVDD_ D NC BST_ D GVDD_D

AR17 3.3OHM AC33

10NF

AR18 3.3OHM

10NF

AC34

100NF

AC27 AC30

470NF

R+

AC29 100NF

AR13

18OHM

AC23

330PF

AC24

AR14

18OHM 330PF

3.3OHM

1MF AC60

10NF

4

SPK2

AR30

0OHM

4 2 1 3

AC49 33NF

AC48 +12V_A_PW 100NF

AC58

10NF

1

4

2

3

AR32

3.3OHM

1MF

MGND2

0OHM OPTION

MGND1

DGND

L21 1

3

2

4

DGND DGND

L2

DGND

L+

AC46 1UF

AC56

AR29 3.3O HM

AR27 10OHM

AC44 10UF AC45 100NF

2 DGND

10NF

PWM_D

GND_ D

AC57

100NF

10NF

/RESET_ CD

GND_ C

AC51 AC52 33NF

3.3OHM

PWM_C

OUT_C OUT_ C

3

OPTION

AR19

M1

BST_ C PVDD_ C

L11 1

AC50 100NF

100NF

M2

BST_ B

AC35

M3

PVDD_ B

100NF AR20 AC36

VREG

OUT_ B OUT_B

AC53 33NF

AC31

AGND

GND_ B

470NF

GND

GND_ A

3

AC28 AC32

OC_ ADJ

OUT_ A OUT_A

2

AR15

PWM_B

DGND

4

18OHM

/RESET_ AB

PVDD_ A

DGND

AC25

PWM_A

PVDD_ A

33NF

330PF

/SD

NC

AC54

AC26

NC

BST_ A

44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23

AR16

NC

GVDD_A

18OHM 330PF

AR26 10OHM

/OTW

AC47 1UF

OPLCH

GVDD_B

AC55

100NF

330PF

AC42

TI_RS T

AC41 1UF

AC40 1UF

OPRCH

AIC2

L1

1

-

TI_S TI_SD D

1 2 3 4 DGND 5 6 7 AR24 8 AR23 22KO HM 9 0OHM 10 11 12 13 AC43 DGND 14 15 100NF 16 17 18 +12V_A_PW 19 AR25 20 3.3O HM 21 22

TAS5342ADDV

+

AR21 10OHM

AR31

0OHM OPTION

+

AR22 10OHM

-

+12V_A_PW

AR28

FL+

AR33

0OHM

OPTION

Copyright© 1995-2013 SAMSUNG. All rights reserved.

L-

DGND

6-7

6. Schematic Diagram

6.7. SMPS-1 RM851 1(32 16) B+_380 V_CT_P

N201_S

f TM892S EE25 25W

B-28V_20 0V_SW_S € ‚

DM852 UF4004

EY811

f

EY810 CM806 1KV 10nF

f

+

DBM801 GBU605 600V,6A

CM801 450V 120uF RU

CM805 630V 10nF

RM801 68K 2W

„

EY809

Drain1_550V_S W _P

RM860 10K(1608)

PS-O N_S

RM893 10K(1 608)

3

2

NE _ LX2 _ P

TRM892 KTN2222AS S OT-23

RM895 10K (16 08) N209_S

N207_S

LX802S CV615280S

… {†

5

€

N.C

CM815 100nF 50V (16 08)

CM803 50V 47uF RD

DM858 SB3 100



DM859 N.C

ˆ {€ 

CS1_CT _P

NE_LX1_P

3

2

f

f

CY891S 250VAC 1000pF

CY892S 250VAC 1000pF

GND_S DM851 UF4004

TRM851 KTC3205 TO-92L

FB1_CT_P

N111_P

RM853 1K(1608)

RM872 5.1K/F (1608)

N216_S

f

CM804 1nF 50V (1608)

f

VX801S 14D751

N217_S

GND_P

f FP 801S T3.15AL/250VAC

EY801

VCC2_CT_P

DM812 RB551V-30 S OD-323

TRM811 KTN2907AS S OT-23

RM812 15K(1608) N113_P

GND_P

B-3.4V_DC_S

GND_S

RM879 20K/F (1608) N225_S

ICM851 KIA431AM S OT-23

RM877 4.7K(3216)

TRM855 KTN2222AS S OT-23 GND_S TRM852 KTN2222AS S OT-23

RM857 6.8K/F (1608)

RM873 20K(3216)

P S -ON_S

N224_S

EY802 NE _ IN_ P CM891 N.C

1 2

LI_ IN_ P

f

CM878 CM899 220nF 50V RM822 N.C (1608) N.C(1608)

GND_S

N220_S

RM855 10K(1608)

CY895S 250VAC 470pF

RM875 1(1608)

N226_S

CM856 100nF 50V N218_S (1608)

f

N112_P

RM856 680/F (1608)

CM872 33pF 50V (1608)

L1_FP _P

f

N219_S RM854 1K(1608)

IC891S LTV817(B)

CX801S 275VAC,0.33uF

B+3.4V_DC_S

RM859 10K(3216)

GND_S

DM804 N.C

CM873 10nF 100 V

CM861 50V 22uF RD

CM877 470nF 50V (20 12) N215_S

RM85 8 10K(1608) N214_S

‡

DM803 12V,1000mW S OD-123

DM853 3.3V S OD-123

N2 1 3 _ S

CM851 50V 47uF RD

RM804 4.7(3216)

f

GND_S

CM859 10V 470uF RD

CM871 10V 1000uF RD

CM857 10V 1000uF RD

EY803

RX801S 1/2W 1.2M

RM897 1(16 08)

A5.3V_DC_S FBM851 3.5*5.0 Axial

RM803 2W 1.0

CM802 220nF 50V (16 08)

4

1

f

CM862 25V 100uF RD

RM896 10K(3 216)

N2 1 1 _ S

N2 1 2 _ S

VFD_30V_S W_S € €

BA_CT_P EY804

LX801S CV615280S

CM895 100n 50V (16 08)

DM857 SB3 100

RM869 1(32 16)

EY805

N.C

A5 .3 V_ 4 0 V_ S W_ S … {†

4

3

NT80 1S 5D-15

2

1

f

LI_LX1_P

RM894 10K (16 08)

CM896 100n 50V (160 8) N208_S

N210_S

CM898

Dra in

N.C

7 VCC

GND

ICM801 ICE3B R1765JZ

CS

CX802S 275VAC, 0.33uF

F.B

f

BA

f

EY806

8

EY807

L1_NT_P

CM863 25V 100uF RD

CM897 470nF 50V (20 12)

EY812

4

1

VCC1_CT _P

GND_S

B12V_DC_S € 

f

RM876 1(16 08)

CM880 220nF 50V (16 08)

N102_SW _P

RM802 10(3 216) N103_P N104_SW _P

CM858 22uF 50V RD

TRM891 KTA1572 TO-92L

EY808 DM802 UF4004

N205_S

PS-O N_S

TRM854 KTN2907AS S OT-23

N206_S B12V_80 V_SW_S

LI_ LX2 _ P

CM879 470nF 50V (20 12)

RM861 3.3K(1608) N204_S

DM891 SB1 100

ƒ

FBM801 3.5*5.0 Radial

CM852 N.C (16 08)

RM891 N.C (20 12)

N101_P

DM801 UF4007

GND_P

ˆ {€ 

KTD863 TO-92L

CM853 100nF 50V (16 08) N203_S

CM892 10uF 50V RD

B-28V_DC_S

TRM853

N202_S

RM811 15K(1608)

GND_S

DM811 N114_P

CM860 1nF 50V (1608)

N115_P

PD8 01S 1N4148W S OD-123

YW396-03AV(WHITE)

f IC892S LTV817(B) N2 2 1 _ S

RM871 680(3216)

N222_S

DM855 1N4148W S OD-123

GND_S

N2 2 3 _ S

GND_P

6-8

Copyright© 1995-2013 SAMSUNG. All rights reserved.

6. Schematic Diagram

6.8. SMPS-2

f B+_38 0V_CT_P

CY894S 250V 470pF

f

GND_S

TA891S EER3335H CA851 1KV 10nF

EY814 RA809 2W 68K VCC2_CT _P

RA811 68K(1 608)

1 FB2_CT_P CS2_CT _P

RA801 10K (160 8)

ZC

8

2

FB

VCC

7

3

CS

GATE

6

4

DA802 4.7V SO D-123

GND

HV

f

HV

Gat e_CT_P

B33V_15 0V_SW_S

DA805 UF4007

ƒ {„

DA807 RB551V-30 S OD-323

MA801 TMP F10N65A TO-220F

N152_SW _P

N159_P

CA805 1uF 50V (20 12)

N252_S

GND_P

DA853 18V SO D-123

…

RA853 3.3K(1608)

5W 0.1

RA854 1.5K(1608) N256_S

TRA801 KTN2222AS S OT-23

CNM852

RA858 43K/F (1608)

EY813

RA807

CA806 220pF 50V (16 08)

GND_S

‚

B33V_DC_S

13

GND_S

11

B12V_D C_S

9

A5.3V_DC_S

7

P S -ON_S

5

B+3.4V_DC_S

3

B-28V_DC_S

1

N253 _S RA857 15K/F(1608) CA861 33pF 50V (1608)

f DA801 RB551V-30 S OD-323

IC893S LTV817(B) CA803 1nF 50V (1608)

DA803 12V S OD-123

22K(2 012)

CA862 100nF 50V (16 08)

EY816

HS801

f

RA805 220(3 216)

RA804 1K(20 12)

N158_P

RA861 CA857 N.C

† {‡

f

N157_P

RA802 18K(1608)

CA854 50V 680uF MK

€  {€ € {€ 

CA808 1KV 220 pF

N156_P

ICA801 ICE2Q S03

EY815

EY17

RA806 4.7(3216) RA803 33K(2 012)

LA851 5*18, 2. 2uH BAR CHOKE

DA862 S F35G

DA863 S F35G

FBA801 3.5*5.0 Radial

N155_P

5

B33V_DC_S

N251_S

Drain2_550V_ S W_P

N153_P

ZC_CT _P

DA861 S F35G

€ {

N151_P

DA806 N.C

CA801 68pF 50V (16 08)

CA809 630V 10nF

CA802 1nF 50V (1608)

N254_S

CA853 22nF 50V (1608)

12

B33V_DC_S

10

GND_S

8

GND_S

6

A5.3V_DC_S

4

GND_S

2

B-3.4V_DC_S

N255_S RA855

N257_S

127301113K2

100K(1608)

ICA851 KIA431AM S OT-23

RA859 4.7K/F(1608)

GND_P CY896S N.C

GND_P

Copyright© 1995-2013 SAMSUNG. All rights reserved.

GND_S

GND_S

6-9

GSPN (GLOBAL SERVICE PARTNER NETWORK) Area

Web Site

Europe, MENA, CIS, Africa

https://gspn1.samsungcsportal.com

E.Asia, W.Asia, China, Japan

https://gspn2.samsungcsportal.com

N.America, S.America

https://gspn3.samsungcsportal.com

This Service Manual is a property of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under applicable International and/or domestic law.

© 2013 Samsung Electronics Co.,Ltd. All rights reserved. Printed in Korea