DATE: 2017. 10 .21 REV: Rev. B PRODUCT FAMILY DATA SHEET High Power LED series 3535 Ceramic MODEL NAME : LEMW A332 ***
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DATE: 2017. 10 .21 REV: Rev. B
PRODUCT FAMILY DATA SHEET
High Power LED series 3535 Ceramic MODEL NAME : LEMW A332 *** *****
APPROVAL
REMARK
APPENDIX
DESIGNED
CHECKED
APPROVED
2017.10.21
2017.10.21 J.B.Choi
2017.10.21 J.J.Yoon
N.H.Kim
T ABLE OF CONTENTS
1. Features
---------------------
2
2. Applications
---------------------
2
3. Outline Dimensions
---------------------
2
4. Absolute Maximum Ratings
---------------------
3
5. Electro-Optical Characteristics
---------------------
3~5
6. Flux Characteristics and Order Code
---------------------
6~7
7. Chromaticity Bins
---------------------
8~10
8. Typical Characteristic Curves
---------------------
11~18
9. Reliability Test Items and Conditions
---------------------
19
10. Packing and Labeling of Products
---------------------
20~23
11. Cautions on Use
---------------------
24~27
12. Disclaimers
---------------------
27
13. Package Nomenclature
---------------------
28
1
1. Features - Lighting Color : White - Lead Frame Type LED Package : 3.40 x 3.40 x 2.37 (L x W x H) [Unit : mm] - Viewing Angle : 120˚
- Chip Material : InGaN - Soldering Methods : Reflow soldering - ESD Withstand Voltage : Up to 8kV According to JS-001
2. Applications - Interior and Exterior Illumination
3. Outline Dimensions
( Unit : mm )
Anode Mark
Recommendable Soldering Pattern (for Reflow Soldering)
Internal Circuit Pad Configuration Cathode ③ -
Anode ①
③
②
+
①
① Anode Pad ② Thermal Pad ③ Cathode Pad
ESD Protection
Tolerances unless otherwise mentioned are ± 0.13 mm
2
4. Absolute Maximum Ratings ( Ta=25℃)
Item
Symbol
Rating
Unit
If
2000
mA
Operating Temperature
Topr
-40 ~ +105
℃
Storage Temperature
Tstg
-40 ~ +125
℃
Junction Temperature
Tj
150
℃
Forward Current
Soldering Temperature
JEDEC-J-STD-020
ESD Classification
Class 3B (JS-001)
※ Operating the LED beyond the listed maximum ratings may affect device reliability and cause permanent damage. These or any other conditions beyond those indicated under recommended operating conditions are not implied. The exposure to the absolute maximum rated conditions may affect device reliability. ※ The LEDs are not designed to be driven in reverse bias.
5. Electro - Optical Characteristics Item
Symbol
Condition
Cool + CRI 70, 80 Luminous Flux
Neutral + CRI 70, 80
Typ.
Max.
Unit
281 Φv
267
Warm + CRI 70, 80
Refer to ‘Flux Bins’
lm
253
Forward Voltage
Vf
Color Coordinate
Cx / Cy
IF = 700mA Tj = 85℃
Color Rendering Index (CRI)
Min.
2.65
2.85
3.10
V
Refer to ‘Chromaticity Bins’
-
70
-
-
80
-
-
-
120
-
deg
-
4
-
°C/W
-1.0
-
-4.0
mV/°C
Ra
Viewing Angle
2Θ1/2
Thermal Resistance, Junction to Solder
Rth j-s
Temperature Coefficient of Forward Voltage*1)
ΔVf / ΔTj
IF = 700mA
*1) Measured at Ta between 25℃ and 150℃. ※ These values are measured by the LG Innotek optical spectrum analyzer within the following tolerances. Luminous Flux (Φv) : ±7%, Forward Voltage (Vf) : ±0.1V, Color Value : ±0.005, CRI Value : ±2, ※ Although all LEDs are tested by LG Innotek equipment, some values may vary slightly depending on the conditions of the test equipment.
3
5. Electro - Optical Characteristics (Continued) ( Tj=85℃) CCT
Typical CRI
70 4500~6500K (Cool White) 80
70 4000K (Neutral White) 80
70 3000K (Warm White) 80
If (mA)
Vf (V)
Power (W)
Φv (Im)
lm/W
350 700 1,000 1,500 2,000 350 700 1,000 1,500 2,000 350 700 1,000 1,500 2,000 350 700 1,000 1,500 2,000 350 700 1,000 1,500 2,000 350 700 1,000 1,500 2,000
2.75 2.85 2.92 3.02 3.10 2.75 2.85 2.92 3.02 3.10 2.75 2.85 2.92 3.02 3.10 2.75 2.85 2.92 3.02 3.10 2.75 2.85 2.92 3.02 3.10 2.75 2.85 2.92 3.02 3.10
0.96 2.00 2.92 4.53 6.20 0.96 2.00 2.92 4.53 6.20 0.96 2.00 2.92 4.53 6.20 0.96 2.00 2.92 4.53 6.20 0.96 2.00 2.92 4.53 6.20 0.96 2.00 2.92 4.53 6.20
171.0 316.9 427.6 597.1 745.3
178.1 158.5 146.4 131.8 120.2 168.0 148.2 136.4 121.8 111.0 174.3 154.3 142.4 127.4 116.6 166.0 146.4 134.7 120.0 109.4 167.4 147.9 136.6 122.3 110.7 157.3 138.4 127.3 113.3 103.0
4
161.3 296.3 398.3 551.6 688.1 167.3 308.7 415.9 576.9 723.1 159.4 292.7 393.4 543.8 678.0 160.7 295.7 398.9 554.2 686.1 151.1 276.7 371.6 513.2 638.7
5. Electro - Optical Characteristics (Continued) ( Ta=25℃) CCT
Typical CRI
70 4500~6500K (Cool White) 80
70 4000K (Neutral White) 80
70 3000K (Warm White) 80
If (mA)
Vf (V)
Power (W)
Φv (Im)
lm/W
350 700 1,000 1,500 2,000 350 700 1,000 1,500 2,000 350 700 1,000 1,500 2,000 350 700 1,000 1,500 2,000 350 700 1,000 1,500 2,000 350 700 1,000 1,500 2,000
2.85 2.95 3.02 3.12 3.20 2.85 2.95 3.02 3.12 3.20 2.85 2.95 3.02 3.12 3.20 2.85 2.95 3.02 3.12 3.20 2.85 2.95 3.02 3.12 3.20 2.85 2.95 3.02 3.12 3.20
1.00 2.07 3.02 4.68 6.40 1.00 2.07 3.02 4.68 6.40 1.00 2.07 3.02 4.68 6.40 1.00 2.07 3.02 4.68 6.40 1.00 2.07 3.02 4.68 6.40 1.00 2.07 3.02 4.68 6.40
180.0 337.2 459.8 649.0 819.0
180.5 163.3 152.3 138.7 128.0
168.0 311.9 423.7 593.1 747.9 178.0 331.9 452.1 634.0 803.4
168.0 150.7 140.3 126.7 116.9 178.4 160.7 149.7 135.5 125.5
166.0 308.1 418.5 584.7 737.0 171.0 318.0 433.6 609.0 762.3
166.0 148.9 138.6 124.9 115.2 171.4 154.0 143.6 130.1 119.1
159.0 294.4 399.6 557.8 701.9
159.0 142.2 132.3 119.2 109.7
5
6. Flux Bins and Order Code (Tj=85℃ / Ta=25℃) Luminous Flux [lm] CRI
CCT (Color)
6500K 5700K 70
@700mA, 85℃
@700mA, 25℃
Min.
Max.
Min.
Max.
X9
281
295
296
311
XA
295
309
311
326
Bin Code
5000K
Order Code
LEMWA33270F***** LEMWA33270G***** LEMWA33270H*****
XB
309
323
326
340
XC
323
337
340
355
X7
253
267
266
281
5000K
X8
267
281
281
296
LEMWA33280H*****
4000K
X9
281
295
296
311
LEMWA33280J*****
XA
295
309
311
326
4000K 3000K
5700K
LEMWA33270J***** LEMWA33270L*****
LEMWA33280G*****
80
3000K
LEMWA33280L*****
6
6. Flux Bins and Order Code Flux Bins Sortation Min
Typ
CRI [Ra]
CCT [K]
70
Rank Tj = 85℃ @700mA Ta = 25℃ @700mA
Flux Bins X7
X8
X9
XA
XB
XC
253-267
267-281
281-295
295-309
309-323
323-337
266-281
281-296
296-311
311-326
326-340
340-355
6500
70F
XA
XB
XC
5700
70G
XA
XB
XC
5000
70H
XA
XB
XC
4000
70J
XA
XB
XC
4000
70L
X9
XA
XB
5700
80G
X8
X9
XA
5000
80H
X8
X9
XA
4000
80J
X8
X9
XA
3000
80L
X8
X9
80
X7
Forward Voltage Bins Bin
Vf (V) @700mA, 85℃
Vf (V) @700mA, 25℃
Min.
Max.
Min.
Max.
0
2.65
2.9
2.75
3.0
1
2.9
3.1
3.0
3.2
7
7. Chromaticity Bins LG Innotek complies with the ANSI C78.377A standard for its chromaticity bin
structure. For each ANSI quadrangle for the CCT range of 4500K to 6500K, LG Innotek provides 4 bins.
Bin
FC1
FC2
FC3
FC4
CIE X
CIE Y
0.3043 0.3138 0.3152
0.3386
0.3063
0.3299
0.3063 0.3152 0.3166
0.3282
0.3083 0.3138 0.3232
0.3584
0.3240
0.3472
0.3152
Bin
CIE X
CIE Y
0.3395
0.3234
0.3490
0.3326 0.3327
0.3524
0.3242
0.3448
0.3299
0.3242
0.3386
0.3327 0.3328
0.3405
0.3202
0.3250
0.3490
0.3326 0.3416
0.3724
0.3411
0.3599
0.3386
0.3327
0.3152
0.3386
0.3240
0.3472
0.3248
0.3361
0.3166
0.3282
GC1
GC2
GC3
GC4
Bin
CIE X
CIE Y
0.3558
0.3416
0.3642
0.3509 0.3498
0.3661
0.3410
0.3591
0.3448
0.3410
0.3524
0.3498 0.3486
0.3529
0.3337
0.3405
0.3642
0.3509 0.3602
0.3868
0.3584
0.3731
0.3524
0.3498
0.3327
0.3524
0.3411
0.3599
0.3406
0.3473
0.3328
0.3405
HC1
HC2
HC3
HC4
8
Bin
CIE X
CIE Y
0.3715
0.3598
0.3836
0.3792
0.3698
0.3909
0.3672
0.3765
0.3580
0.3699
0.3591
0.3580
0.3699
0.3661
0.3672
0.3765
0.3647
0.3624
0.3465
0.3562
0.3563
0.3792
0.3698
0.3909
0.3799
0.3983
0.3765
0.3830
0.3661
0.3672
0.3765
0.3498
0.3661
0.3672
0.3765
0.3584
0.3731
0.3765
0.3830
0.3566
0.3591
0.3732
0.3685
0.3486
0.3529
0.3647
0.3624
IC1
IC2
IC3
IC4
7. Chromaticity Bins (Continued) LG Innotek complies with the ANSI C78.377A standard for its chromaticity bin
structure. For each ANSI quadrangle for the CCT range of 2700K to 4000K, LG Innotek provides 16 bins.
Bin
J11
J12
J13
J14
CIE X
CIE Y
0.3796
0.3970
0.3868
0.4016
0.3849
0.3938
0.3779 0.3779
Bin
CIE X
CIE Y
0.4066
0.4103
CIE X
CIE Y
0.4376
0.4241
0.4145
0.4141
0.4114
0.4056
0.4443
0.4266
0.4402
0.4175
0.3895
0.4038
0.3895
0.4038
0.4019
0.4336
0.4019
0.4336
0.3849
0.3938
0.4114
0.4056
0.3829
0.3862
0.3763
0.3821
0.4083
0.3970
0.4010
0.3935
0.3868
0.4016
0.4145
0.4141
0.3939
0.4061
0.3917
0.3981
0.4223
0.4180
0.4190
0.4094
0.3849
0.3938
0.4114
0.3849
0.3938
0.3917
0.3981
0.3895
0.3903
0.3829
0.3862
K11
K12
K13
K14
Bin
CIE X
CIE Y
0.4641
0.4323
0.4706
0.4339
0.4656
0.4244
0.4151
0.4593
0.4230
0.4151
0.4593
0.4230
0.4402
0.4175
0.4656
0.4244
0.4360
0.4082
0.4604
0.4149
0.4297
0.4060
0.4544
0.4134
0.4443
0.4266
0.4706
0.4339
0.4512
0.4291
0.4770
0.4354
0.4469
0.4199
0.4718
0.4259
0.4056
0.4402
0.4175
0.4656
0.4244
0.4114
0.4056
0.4402
0.4175
0.4656
0.4244
0.4190
0.4094
0.4469
0.4199
0.4718
0.4259
0.4156
0.4006
0.4424
0.4105
0.4665
0.4163
0.4083
0.3970
0.4360
0.4082
0.4604
0.4149
L11
L12
L13
L14
9
Bin
M11
M12
M13
M14
7. Chromaticity Bins (Continued) Bin
J21
J22
J23
J24
J31
J32
J33
J34
J41
J42
J43
J44
CIE X
CIE Y
0.3763 0.3829 0.3810 0.3746 0.3746 0.3810 0.3790 0.3729 0.3829 0.3895 0.3873 0.3810 0.3810 0.3873 0.3850 0.3790 0.3939 0.4011 0.3986 0.3917 0.3917 0.3986 0.3962 0.3895 0.4011 0.4082 0.4054 0.3986 0.3986 0.4054 0.4027 0.3962 0.3895 0.3962 0.3937 0.3873 0.3873 0.3937 0.3912 0.3850 0.3962 0.4027 0.4000 0.3937 0.3937 0.4000 0.3973 0.3912
0.3821 0.3862 0.3785 0.3746 0.3746 0.3785 0.3708 0.3671 0.3862 0.3903 0.3824 0.3785 0.3785 0.3824 0.3745 0.3708 0.4061 0.4106 0.4024 0.3981 0.3981 0.4024 0.3944 0.3903 0.4106 0.4150 0.4067 0.4024 0.4024 0.4067 0.3985 0.3944 0.3903 0.3944 0.3863 0.3824 0.3824 0.3863 0.3782 0.3745 0.3944 0.3985 0.3902 0.3863 0.3863 0.3902 0.3819 0.3782
Bin
K21
K22
K23
K24
K31
K32
K33
K34
K41
K42
K43
K44
CIE X
CIE Y
0.4010 0.4083 0.4055 0.3984 0.3984 0.4055 0.4026 0.3958 0.4083 0.4156 0.4125 0.4055 0.4055 0.4125 0.4093 0.4026 0.4223 0.4304 0.4268 0.4190 0.4190 0.4268 0.4231 0.4156 0.4304 0.4389 0.4349 0.4268 0.4268 0.4349 0.4308 0.4231 0.4156 0.4231 0.4197 0.4125 0.4125 0.4197 0.4162 0.4093 0.4231 0.4308 0.4270 0.4197 0.4197 0.4270 0.4232 0.4162
0.3935 0.3970 0.3889 0.3855 0.3855 0.3889 0.3809 0.3777 0.3970 0.4006 0.3923 0.3889 0.3889 0.3923 0.3841 0.3809 0.4180 0.4220 0.4132 0.4094 0.4094 0.4132 0.4042 0.4006 0.4220 0.4262 0.4172 0.4132 0.4132 0.4172 0.4079 0.4042 0.4006 0.4042 0.3958 0.3923 0.3923 0.3958 0.3874 0.3841 0.4042 0.4079 0.3994 0.3958 0.3958 0.3994 0.3907 0.3874
Bin
L21
L22
L23
L24
L31
L32
L33
L34
L41
L42
L43
L44
10
CIE X
CIE Y
0.4297 0.4360 0.4321 0.4260 0.4260 0.4321 0.4282 0.4224 0.4360 0.4424 0.4383 0.4321 0.4321 0.4383 0.4343 0.4282 0.4512 0.4581 0.4535 0.4469 0.4469 0.4535 0.4488 0.4424 0.4581 0.4650 0.4601 0.4535 0.4535 0.4601 0.4552 0.4488 0.4424 0.4488 0.4444 0.4383 0.4383 0.4444 0.4402 0.4343 0.4488 0.4552 0.4506 0.4444 0.4444 0.4506 0.4462 0.4402
0.4060 0.4082 0.3996 0.3974 0.3974 0.3996 0.3911 0.3890 0.4082 0.4105 0.4018 0.3996 0.3996 0.4018 0.3932 0.3911 0.4291 0.4316 0.4222 0.4199 0.4199 0.4222 0.4128 0.4105 0.4316 0.4340 0.4246 0.4222 0.4222 0.4246 0.4150 0.4128 0.4105 0.4128 0.4039 0.4018 0.4018 0.4039 0.3953 0.3932 0.4128 0.4150 0.4061 0.4039 0.4039 0.4061 0.3975 0.3953
Bin
M21
M22
M23
M24
M31
M32
M33
M34
M41
M42
M43
M44
CIE X
CIE Y
0.4544 0.4604 0.4557 0.4498 0.4498 0.4557 0.4509 0.4452 0.4604 0.4665 0.4616 0.4557 0.4557 0.4616 0.4567 0.4509 0.4770 0.4835 0.4781 0.4718 0.4718 0.4781 0.4726 0.4665 0.4835 0.4900 0.4844 0.4781 0.4781 0.4844 0.4787 0.4726 0.4665 0.4726 0.4675 0.4616 0.4616 0.4675 0.4624 0.4567 0.4726 0.4787 0.4734 0.4675 0.4675 0.4734 0.4681 0.4624
0.4134 0.4149 0.4059 0.4045 0.4045 0.4059 0.3970 0.3957 0.4149 0.4163 0.4073 0.4059 0.4059 0.4073 0.3984 0.3970 0.4354 0.4369 0.4274 0.4259 0.4259 0.4274 0.4177 0.4163 0.4369 0.4384 0.4289 0.4274 0.4274 0.4289 0.4191 0.4177 0.4163 0.4177 0.4087 0.4073 0.4073 0.4087 0.3997 0.3984 0.4177 0.4191 0.4100 0.4087 0.4087 0.4100 0.4011 0.3997
8. Typical Characteristic Curves Forward Current vs. Forward Voltage Ta = 85℃
Forward Current [mA]
2000
1500
1000
500
0 2.4
2.6
2.8
3.0
3.2
Forward Voltage [V]
Relative Luminous Flux vs. Forward Current Ta = 85℃
450
Relative Luminous Flux [%]
400 350 300
250 200 150 100 50 0 0
250
500
750
1000
1250
Forward Current [mA]
11
1500
1750
2000
8. Typical Characteristic Curves Spectrum
Relative Spectral Power Distribution
100
Ta = 85℃
CRI Ra 70~ Warm White Neutral White Cool White
80
60
40
20
0 380
430
480
530
580
630
Wavelength [nm]
12
680
730
780
8. Typical Characteristic Curves Chromaticity Coordinate vs. Forward Current Tj = 85℃ 0.020 Cx Cy
ΔChromaticity Coordinate
0.015
5000~6500K
0.010
0.005
0.000 200
500
800
1100
1400
1700
2000
-0.005
-0.010
-0.015
-0.020
Forward Current [mA]
Tj = 85℃
0.020 Cx Cy
ΔChromaticity Coordinate
0.015
4000K
0.010
0.005
0.000 200
500
800
1100
1400
-0.005
-0.010
-0.015
-0.020
Forward Current [mA]
13
1700
2000
8. Typical Characteristic Curves Chromaticity Coordinate vs. Forward Current Tj = 85℃
0.020 Cx Cy
ΔChromaticity Coordinate
0.015
3000K
0.010
0.005
0.000 200
500
800
1100
1400
1700
2000
-0.005
-0.010
-0.015
-0.020
Forward Current [mA]
Luminous Flux vs. Temperature If = 700mA
120
Relative Luminous Flux [%]
100
80
60
40
20
0 -40
-25
-10
5
20
35
50
Ambient Temperature [℃]
14
65
80
95
8. Typical Characteristic Curves Chromaticity Coordinate vs. Temperature If = 700mA 0.020 Cx Cy
ΔChromaticity Coordinate
0.015
5000~6500K
0.010 0.005 0.000 -0.005 -0.010 -0.015 -0.020 25
40
55
70
85
100
Ambient Temperature [℃]
If = 700mA 0.020 Cx Cy
ΔChromaticity Coordinate
0.015
4000K
0.010 0.005 0.000 -0.005 -0.010 -0.015 -0.020 25
40
55
70
Ambient Temperature [℃]
15
85
100
8. Typical Characteristic Curves Chromaticity Coordinate vs. Temperature If = 700mA 0.020 Cx Cy
ΔChromaticity Coordinate
0.015
3000K
0.010 0.005 0.000 -0.005 -0.010 -0.015 -0.020 25
40
55
70
85
100
Ambient Temperature [℃]
Forward Voltage vs. Temperature If = 700mA 0.60 0.50
Δ Forward Voltage [V]
0.40 0.30 0.20 0.10 0.00
-0.10 -0.20 -40
-25
-10
5
20
35
50
Ambient Temperature [℃]
16
65
80
95
8. Typical Characteristic Curves Radiation Characteristics Ta = 25℃, If = 700mA
X-X
Y-Y
-30
-30
30
-60
-90 100
Cool
60
50
0
50
-60
-90 100
90 100
60
50
90
X-X
Ta = 25℃, If = 700mA
30
-90
90
Y-Y
Ta = 25℃, If = 700mA
Ta = 25℃, If = 700mA
0 -30
30
-60
60
0
90 100
60
0
50
Y-Y
Neutral -60
60
-90
50
-30
30
-60
-90 100
0
0
0
-30
30
Ta = 25℃, If = 700mA
X-X -30
Ta = 25℃, If = 700mA
0
0
50
Warm
-60
-90 100
90 100
17
30
60
50
0
50
90 100
8. Typical Characteristic Curves Derating Curve 2500
Maximum Current [mA]
2000
1500
1000 Rthj-a=10℃ /W
500
Rthj-a=15℃/W Rthj-a=20℃/W
0
0
25
50
75
100
Ambient Temperature [℃] ※ The ambient temperature values for each graph are obtained with LG Innotek equipment.
18
9. Reliability Test Items and Conditions 9-1. Failure Criteria Items
Symbol
Test Conditions
Forward Voltage
Vf
Luminous Flux
Φv
Criteria Min.
Max.
If = 350mA
-
Initial Value 1.1
If = 350mA
Initial Value 0.7
-
9-2. Reliability Tests Test Sample Hours Ac/Re Size /Cycles
No
Items
Test Conditions
1
Room Temperature Operating Life (RTOL)
Ta = 25℃, If = 2,000mA
1,000 Hours
11 pcs
0/1
2
Wet High Temperature Operating Life (WHTOL)
Ta = 85℃, RH = 85% If = 1,000mA(Max. Tj=120℃)
500 Hours
11 pcs
0/1
3
High Temperature Operating Life (HTOL)
Ta = 85℃, If = 1,500mA
1,000 Hours
11 pcs
0/1
4
Low Temperature Operating Life (LTOL)
Ta = -40℃, If = 1,500mA
1,000 Hours
11 pcs
0/1
5
High Temperature Storage Life (HTSL)
Ta = 100℃
1,000 Hours
11 pcs
0/1
6
Low Temperature Storage Life (LTSL)
Ta = -40℃
1,000 Hours
11 pcs
0/1
7
Wet High Temperature Storage Life (WHTSL)
Ta = 85℃, RH = 85%
1,000 Hours
11 pcs
0/1
8
Temperature Cycle (TC)
-40℃(30min) ~ 100℃(30min)
100 Cycles
11 pcs
0/1
9
Moisture Sensitivity Level (MSL)
Tsld = 260℃ (Pre treatment 60℃,60% 168 hours)
3 Times 11 pcs
0/1
10
Electrostatic Discharge Test Voltage 8kV (HBM)
3 Times 11 pcs
0/1
100~2000~100Hz 48 Sweep 4min. 20 pcs Minutes 200m/s², 3 directions, 4Cycles
0/1
R1
11
Vibration
V
R2 S1 C
D.U.T
R1 : 10MΩ, R2 : 1.5kΩ, C : 100pF
※ All samples are tested using LG Innotek Standard Metal PCB (25x25x1.6 mm3(L×W×H)) except MSL test . ※ All samples must pass each test item and all test items must be satisfied.
19
10. Packing and Labeling of Products 10-1. Taping Outline Dimensions Reel ( Unit : mm )
Packing Materials : - Reel : Conductive PS (Black) - Emboss Tape : Conductive PS (Black) - Cover Tape : Conductive PET Base
Tape
Polarity Direction in Pocket Cathode Side
-
Anode mark
+
Cathode
Anode Side
Anode
Taping Arrangement
(End)
(Start)
Unloaded Tape (Min. 200mm)
Mounted with LED (1,000 pcs)
Unloaded Tape (Min. 40mm)
20
Leading Part (700 ~ 800mm)
10. Packing and Labeling of Products 10-2. Label Structure ※. Label A Specifying ‘Lot ID’, ‘Model Name’, ‘MES ID’, ‘RANK’, ‘Q’ty’, ‘Run No’ Lot ID : PPWS03R063M000101
Model : LEMWA33270HU5000 Q’ty : 1000[pcs] MES ID : W070H Run No : H94524-4517 RANK : XB-HC1-0 LEMWA33270HU5000=XB-HC1-0=H94524-4517
40mm
P-J21-2 XB-HC1-0
LG Innotek Co., Ltd.
80mm Run No. indication
1 Code
2
3
4
Manufacture Manufacture Manufacture Site Year Month Korea : 1 China : 9
2017 : 7 ··· 2020 : 0 2021 : 1
1~9 : 1~9 10 : A 11 : B 12 : C
5
6
Manufacture Date ( 01~31)
21
7
8
9 Serial No ( 00 ~ ZZ )
10
10. Packing and Labeling of Products 10-2. Label Structure ※. Label C Specifying ‘Customer’, ‘Date’, ‘Model Name’, ‘Quantity’, ‘Customer Part no’, ‘Outbox ID’, ‘LGIT Internal Model Name’
OutBox
Customer
2017.09.06
LEMWA33270HU5000 /24000 HSO453104 8
40mm
XB-HC1-0 =24000
80mm Box ID. indication
1
2
3
Manufacture Site
PKG Site
Box
Paju :P Huizhou : H
PKG : S, P
Inner Box : I Outer Box : O
4
5
6
7
8
9
Year
Month
Date
Serial No
2017 : 7 ··· 2020 : 0 2021 : 1
1~9 : 1~9 10 : A 11 : B 12 : C
( 01 ~ 31)
( 001 ~ 999 )
22
10
10. Packing and Labeling of Products 10-3. Packing Structures Reeled products(Numbers of products are Max.1,000pcs) packed in a sealed-off and moisture-proof aluminum bag with desiccants(Silica Gel). Maximum four aluminum bags are packed in an inner box
and six inner boxes are packed in an outer box. (Total Max. number of products are 24,000pcs)
Label A
Aluminum moisture proof bag
Vacuum Packing
Silica Gel
1 Bag : 1 Reel / 1 Silica Gel
Label A
Taping Reel
Inner Box
Label A (4ea)
Aluminum moisture -proof bag
ⓒ
ⓑ
ⓐ
Types
ⓐ
Sizes (mm) ⓑ ⓒ
Inner Box
227
82
258
Outer Box
530
240
280
Tolerance : ±10mm Outer Box OPP Tape (50mm) Label C
ⓒ
ⓐ
ⓑ
23
11. Cautions on Use 11-1. Moisture-Proof Package -. The moisture in the SMD package may vaporize and expand during soldering. -. The moisture can damage the optical characteristics of the LEDs due to the encapsulation.
11-2. During Storage Conditions
Temperature
Humidity
Time
Before Opening Aluminum Bag
5℃ ~ 30℃
< 50%RH
Within 1 Year from the Delivery Date
After Opening Aluminum Bag
5℃ ~ 30℃
< 60%RH
≤ 672 hours
65 ± 5℃
< 10%RH
10 ~ 24 hours
Storage
Baking
-. The LEDs should be stored in a clean environment. If the LEDs are stored for 3 months of more after being shipped from LGIT, a sealed container with a nitrogen gas should be used for storage. -. When storing the LEDs after opening aluminum bag, reseal with a moisture absorbent material inside
11-3. During Usage -. The LED should be avoided direct contact with hazardous materials such as sulfur, chlorine, phthalate, acid, solvent, etc. These materials(S, Cl, VOCs, etc) may cause sulfurization of silver lead-frame or encapsulant silicone discoloration in LED. VOCs(Volatile Organic Compounds) can be generated from adhesives glue, cleaning flux, molding
hardener or organic additive which used in luminaires fixtures and they(VOCs) may cause a significant lumen degradation of LED in luminaires when they exposed to heat or light. To prevent this phenomenon, materials used in luminaires must be carefully selected by users. -. The metal parts on the LED can rust when exposed to corrosive gases. Therefore, exposure to corrosive gases must be avoided during operation and storage. -. The metal parts also can be affected not only by the corrosive gases emitted inside of the end-products but by the gases penetrated from outside environment. -. Extreme environments such as sudden ambient temperature changes or high humidity that can cause condensation must be avoided.
11-4. Cleaning -. Do not use brushes for cleaning or organic solvents (i.e. Acetone, TCE, etc..) for washing as they may damage the resin of the LEDs. -. Isopropyl Alcohol(IPA) is the recommended solvent for cleaning the LEDs under the following
conditions.
Cleaning Condition : IPA, 25℃ max. × 60sec max.
-. Ultrasonic cleaning is not recommended. Pretests should be conducted with the actual cleaning process to validate that the process will not damage the LEDs.
24
11. Cautions on Use 11-5. Thermal Management -. The thermal design of the end product must be seriously considered, particularly at the beginning of the system design process. -. The generation of heat is greatly impacted by the input power, the thermal resistance of the circuit boards and the density of the LED array combined with other components.
11-6. Static Electricity -. Wristbands and anti-electrostatic gloves are strongly recommended and all devices, equipment and machinery must be properly grounded when handling the LEDs, which are sensitive against static electricity and surge.
-. Precautions are to be taken against surge voltage to the equipment that mounts the LEDs. -. Unusual characteristics such as significant increase of current leakage, decrease of turn-on voltage, or non-operation at a low current can occur when the LED is damaged.
11-7. Recommended Circuit -. The current through each LED must not exceed the absolute maximum rating when designing the circuits. -. In general, there can be various forward voltages for LEDs. Different forward voltages in parallel via a single resistor can result in different forward currents to each LED, which also can output different luminous flux values. In the worst case, the currents can exceed the absolute maximum ratings which can stress the LEDs. Matrix circuit with a single resistor for each LED is recommended to avoid the luminous flux fluctuations.
L1 RL1
RL2
L2
L3
L1
L2
L3
L1
L2
L3
RL3 RL
Fig.1 Recommended Circuit in Parallel Mode : Separate resistors must be used for each LED.
Fig.2 Abnormal Circuit Circuits to Avoid : The current through the LEDs may vary due to the variation in LED forward voltage.
-. The driving circuits must be designed to operate the LEDs by forward bias only. -. Reverse voltages can damage the zener diode, which can cause the LED to fail. -. A constant current LED driver is recommended to power the LEDs.
25
11. Cautions on Use 11-8. Soldering Conditions -. Reflow soldering is the recommended method for assembling LEDs on a circuit board. -. LG Innotek does not guarantee the performance of the LEDs assembled by the dip soldering method. -. Recommended Soldering Profile (according to JEDEC J-STD-020D)
Profile Feature
Pb-Free Assembly
Pb-Based Assembly
Preheat / Soak Temperature Min (Tsmin) Temperature Max (T smax) Maximum time(ts) from Tsmin to T smax
150℃ 200℃ 60~120 seconds
100℃ 150℃ 60~120 seconds
Ramp-up rate (T L to Tp)
3℃/ second max.
3℃/ second max.
Liquidus temperature (T L)
217℃
183℃
Time (tL) maintained above T L
60~150 seconds
60~150 seconds
Maximum peak package body temperature (T p)
260℃
235℃
Time(tp) within 5℃ of the specified temperature (T c)
30 seconds
20 seconds
Ramp-down rate (T p to TL)
6℃/second max.
6℃/second max.
Maximum Time 25℃ to peak temperature
8 minutes max.
6 minutes max.
-. Reflow or hand soldering at the lowest possible temperature is desirable for the LEDs although the recommended soldering conditions are specified in the above diagrams. -. A rapid cooling process is not recommended for the LEDs from the peak temperature.
-. The silicone encapsulant at the top of the LED package is a soft surface, which can easily be damaged by pressure. Precautions should be taken to avoid strong pressure on the silicone resin when leveraging the pick and place machines. -. Reflow soldering should not be done more than two times.
26
11. Cautions on Use 11-9. Soldering Iron -. The recommended condition is less than 5 seconds at 260℃. -. The time must be shorter for higher temperatures. (+10℃ → -1sec). -. The power dissipation of the soldering iron should be lower than 15W and the surface temperature of the device should be controlled at or under 230℃.
11-10. Eye Safety Guidelines -. Do not directly look at the light when the LEDs are on. -. Proceed with caution to avoid the risk of damage to the eyes when examining the LEDs with optical instruments.
11-11. Manual Handling -. Use Teflon-type tweezers to grab the base of the LED and do not apply mechanical pressure on the surface of the encapsulant.
12. Disclaimers -. LG Innotek is not responsible for any damages or accidents caused if the operating or storage
conditions exceed the absolute maximum ratings recommended in this document. -. The LEDs described in this document are intended to be operated by ordinary electronic equipment. -. The LEDs should not be used at any lighting products together with the other LEDs, which has a different part number. If required, please contact any sales person. -. It is recommended to consult with LG Innotek when the environment or the LED operation is non-
standard in order to avoid any possible malfunctions or damage to product or risk of life or health. -. Disassembly of the LED products for the purpose of reverse engineering is prohibited without prior written consent from LG Innotek. All defected LEDs must be reported to LG Innotek and are not to be disassembled or analyzed. -. The product information can be modified and upgraded without prior notice.
27
13. Package Nomenclature All LEDs are tested and sorted by color, luminous flux and forward voltage where every LED in a tube has only a single color bin, luminous flux bin and forward voltage bin.
However, the forward voltage bin information is not captured in the part number nomenclature. A 16-digit part number is required when orders are placed. LG Innotek leverages the following part number nomenclature. Type
LE = Light Emitting Diode Color RR = Red BB = Blue MW = White PKG Type S M A E
= = = =
SMD Type Module Type Ceramic Type Edge cutted Lens
PKG Dimension
L
E
M
W
A
3
3
2
7
0
H
U
5
0
0
0
Special Code CIE Bin Code 0 1 2 3
= 1 Bins = 4 Bins = 9 Bins = 16 Bins
Special Code Optical Bin (CIE) Optical Bin (CRI) Optical Bin (Flux)
28