Deposition and patterning techniques for Organic Semiconductors Maddalena Binda Organic Electronics: principles, device
Views 247 Downloads 3 File size 2MB
Deposition and patterning techniques for Organic Semiconductors
Maddalena Binda Organic Electronics: principles, devices and applications Milano, November 15-18th, 2011
Overview
Organic materials
DEPOSITION
PATTERNING
• • • • •
Drop casting Spin coating Doctor Blade Dip coating Layer-by-layer, Langmuir-Blodgett • Spray coating
• Screen printing • Soft Lithography • NIL/Embossing • Physical Delamination • Photopatterning • Ink-jet printing
• Vacuum Thermal Evaporation • Organic Vapor Phase Deposition (OVPD) • Organic Molecular Beam Deposition (OMBD)
• Shadow masking • Vapor Jet Printing
M. Caironi
1
Solution processable materials: deposition techniques • Drop casting • Spin coating • Dip coating • Layer-by-layer: Langmuir-Blodgett • Spray coating
Drop Casting Dropping of solution and spontaneous solvent evaporation Evaporation Dropping
Substrate
Film thickness:
Substrate
Substrate
solution concentration
Very simple No waste of material
X Limitations in large area coverage X Thickness hard to control X Poor uniformity
Tricks... • Combination of solvents • Solvents evaporation time: heating of the substrate to speed up the evaporation process and/or improve film morphology
2
Spin Coating I Dropping on spinning substrate Film thickness: dependent on many controllable parameters dω/dt, ω, t, solution viscosity,…
substrate
Good uniformity/reproducibility Good control on thickness
X Waste of material X No large area X Film dries fast less time for molecular ordering
Easy to obtain film of 10nm or less
Tricks...
180ºC
McCulloch et Al.,
•Thermal annealing
Nat. Mater., 5, 328, (2006)
(post-deposition) •Solvent evaporation time
Chang et Al. Chem. Mater.,16, 23, (2004)
P3HT-based TFTs
Spin Coating II Film thickness:
2v 2 r z 2
h(t )
1 4 t 3
1/ 2
= fluid viscosity = fluid density
ω = rotation speed v = radial velocity
It does not take into account solvent evaporation…
3
Spin Coating III Film thickness: flow dominated
evaporation dominated
viscous flow rate = evaporation rate
hFIN c0 (1 c0 )
1
3
1
2
( 0 )
1
3
c(t)= solids concentration μ µ(t)
most common reported experimental relationship between thickness and rotation speed D. E. Bornside, C. W. Macosko and L. E. Scriven, "Spin Coating of a PMMA/Chlorobenzene Solution", J. Electrochem. Soc., 138, 317 (1991)
How to handle multilayer deposition? Post-deposition film insolubilization Polymer cross-linking Cross-linked polymer chains
Stable, high degree of control X Polymer intrinsic properties are affected
Thermally UV-light
activated
Host cross-linkable polymer
Appliable to any kind of polymer (small molecule?) Doesn’t affect polymer intrinsic properties X Less “deterministic”
X Film properties are affected P. Keivanidis et al., Appl. Phys. Lett. 94, 173303, 2009.
Binda et al., Appl. Phys. Lett. 98, 073303, 2011.
4
Doctor Blading I Spreading through a moving blade onto a stationary substrate stationary moving
Large area No waste of material
X Micrometric precision of blade regulation
Good uniformity
film thickness > 150÷200nm
Example. bladed organic solar cells (P3HT/PCBM) W.-B. Byun et al. / Current Applied Physics 11 (2011)
Doctor bladed active material in comparison with spin-coated (~200nm)
Doctor Blading II Film thickness:
Theoretical height of the wet layer thickness: surface tension, wetting, viscosity, coating speed,... Y. Chou, Y. Ko, M. Yan, J. Am. Ceram. Soc., 7010, 1987. A.I.Y Tok, Journal of Materials Engineering and Performance, 8, 4, 1999.
sol h02 P FilmThick ness h0 1 film 6 UL
U=blade speed µ=fluid viscosity L=channel length =density ho=blade height P=slurry pressure head
5
Doctor Blading refinement I: zone casting Controlled orientation of deposited layers Controlled Deposition of Crystalline Organic Semiconductors Z. Bao, Adv. Mater. 21, 1217–1232, 2009.
by suitably controlling solvent evaporation rate and solution supply Optical microscope
TEM
directional crystallization
substituted hexabenzocoronenes (HBCs)
Doctor Blading refinement II: solution-sheared deposition Z. Bao, Adv. Mater. 21, 1217–1232, 2009.
Diluited solution Pre-heated substrates Top wafer lyophobic
Fast evaporation of the front produces a seeding film with crystal grains that act as nucleation sites TMS-4T
dbo-P2TP
6
Dip Coating The substrate is dipped into the solution and then withdrawn at a controlled speed.
Film thickness:
Thickness (H) determined by the balance of forces at the liquid-substrate interface Landau and Levich equation:
H
0.94 v 2 / 3
1 / 6 g 1 / 2
= fluid viscosity v = withdrawal speed = fluid density g = gravitational acceleration = surface tension (liquid-air)
Solution Quite good uniformity Very thin layers
X Waste of material X Time consuming
Large area coverage
X Double side coverage
Example: TFT based on P3HT in xylene single monolayer ≈ 2 nm thick Sandberg et Al., Langmuir, 18, 26, 2002.
Extreme thickness control: Langmuir-Blodgett film I based on hydrophobicity/hydrophilicity Hydrophilic head Hydrophobic tail
Amphiphilic molecules
water
Molecules move as in a bi-dimensional ideal gas, with a well defined surface pressure P, area A, and density 3D Gas
2D Gas
P [N/m2]
P [N/m]
V [m3]
A [m2]
N [m-3]
n [m-2]
T [k]
T [k]
7
Extreme thickness control: Langmuir-Blodgett film II Isothermal curve
P [Nm-1]
Pc
solid
Reducing the available area, pressure increases and eventually a phase-change occurs: “gas” “liquid” “solid”
l/s
Once PC is reached, a compact molecular mono-layer is formed (”solid” state) and floats on the water surface. At this stage the area cannot be further reduced without destroying the mono-layer.
liquid g/l gas
A [m2]
KSV Instruments Application Note: http://www.ksvltd.fi/Literature/Application%20notes/LB.pdf
Extreme thickness control: Langmuir-Blodgett film III hydrophilic substrate Movable barrier Wilhelmy plate: measures P
Feedback
Head-to-tail
Tail-to-tail Head-to-head
8
Extreme thickness control: Langmuir-Blodgett film IV Excellent control of thickness. An ideal monolayer can be grown
X Only amphyphilic molecules can be deposited
Homogeneity over large areas
X Non trivial setup
Multilayer structures with varying layer composition
Example. C60 dendrimer – n-type TFT LB film: 5 layers
Polar
15nm
Higher mobility than spin-coated film higher morphological order
Apolar Kawasaki et al., Appl. Phys. Lett. 91, 243515, 2007.
Spray Coating Substrate is hit by a vaporized solution flux Nozzle trajectory
substrate
The film morphology can be controlled by: o air pressure o solution viscosity o solvent properties (evaporation rate,…) o gun tip geometry o distance between nozzle and substrate
single pass technique: droplets merge on the substrate into a full wet film before drying smooth films Adjustable layer thickness
multiple pass technique: droplets dry independently rough film, but wettability issues can be overcome X Homogeneity of the film
Large area coverage Independence on substrate topology
9
Spray Coating Example 1. Girotto et al. Adv. Funct. Mater. 2011, 21, 64–72 Spray-coated organic solar cells
Example 2. Organic light sensor directly deposited onto a Plastic Optical Fiber (POF) 1mW
100n
Spray coated bottom electrode
Current [A]
10W 10n
LIGHT 1W 1n
DARK 100p
0
10
20
30
40
50
Time [s]
Compression molding Solid state processing from powders
Baklar et al. Adv. Mater. 2010, 22, 3942–3947 • Applicable to NON-soluble materials • Solid, powdered material placed in a hot press and compressed well below the melting temperatures of the species Medium area No waste of material
X Thickness 1-200µm
Good uniformity Highly ordered films
10
Compression molding Radial molecular flow during compression molding
Free-standing flexible film Material anisotropy
X-ray diffraction
Baklar et al. Adv. Mater. 2010, 22, 3942–3947
Solution processable materials: patterning techniques • Screen printing • Soft Lithography • NIL/Embossing • Physical Delamination • Photopatterning
11
Screen Printing The solution of the active material is squeezed through a screen mask onto the substrate surface
Substrate
It can be applied to spray coating and doctor blading
Mask
Simple
Mask
Z. Bao et al., A. J. Chem. Mater. 9, 1299-1301, 1997.
X Limited resolution:
50-100 m
X Waste of material
Shadow masking+selective wettability Exploiting the difference in wettability between hydrophobic surfaces and hydrophilic surfaces to make the patterns Journal of Polymer Science B: Polymer Physics, 49, 1590–1596, 2011
Hydrophobic SAM (Self Assembled Monolayer)
UV-light damages the ODTS film PEDOT/PSS: conductive polymer from aqueous suspension
12
Shadow masking+selective wettability Journal of Polymer Science B: Polymer Physics, 49, 1590–1596, 2011
Soft Lithography Earliest motivation: overcome cost of photolithography for sub 100nm features Basic idea: replicate patterns generated by photolithography through an elastomeric mold.
Master • Photolithography • X-Ray Litho • EB Litho • FIB writing…
Elastomer • Micro Contact Printing (CP)
Mold
• Micro Transfer Molding (TM) • Micromolding in Capillaries (MIMIC)
Whitesides et al., Angew. Chem. Int. Ed. 1998, 37, 550 -575.
13
Micro-Contact Printing (µCP) I Stamping of an “ink” through the elastomeric mold Printed material has to adhere to the substrate while the interaction with the mold has to be minimal
Critical aspect ratio
PDMS distortion
Micro-Contact Printing (µCP) II Indirect...
... mediated by SAMs Monomolecular layer ~few nm OTS:
modifies substrate chemical proprieties and the wettability Cl Cl Si Cl
(CH2)17
CH 3
Hydrophobic SAM Organic material Hydrophobic region
C. R. Kagan, Appl. Phys. Lett. 79, 3536, 2001
14
Micro-Contact Printing (µCP) III Direct... & additive Substrate pre-treated with O2 plasma to imrpove idrophilicity activating OH- groups
Pentacene TFTs: PEDOT S/D contacts, W/L=140m/2m
Baking step at 80ºC to ensure chemical bonding (an adhesive agent is added to PEDOT:PSS solution) D. Li and J. J. Guo, Appl. Phys. Lett. 88, 063513, 2006.
Example 2. Film grown by LBL technique onto the PDMS mold J.R. Tischler et al., Org. Elec. 8,94–113, 2007.
Patterned LBL deposited Organic Active Material
Micro-Contact Printing (µCP) IV Direct... & subtractive As the stamp is placed in contact with a liquid thin film spread on a substrate, capillary forces drive the solution to form menisci under the stamp protrusions
Dilute solution
Very dilute solution Solution pinned to the edges
b) AFM image of the stamp; c) printed AlQ3 film using dilute solution; d) very dilute solution; e) line profile of stamp and films Cavallini, Nano Lett., Vol. 3, No. 9, 2003.
15
Micro-Contact Printing (µCP) V Direct... & subtractive C. Packard et al., Langmuir 2011, 27, 9073–9076
Applicable also to evaporated/solid films! Patterning mechanism?
Test with oxygen plasma
• Lift-off due to adhesion forces between polymer and stamp
glass
PDMS stamp
before • Organic film removal due to organic molecules diffusion into the PDMS stamp during contact (suggested by time dependence of material removal)
Molecules stimulated fluorescence
glass
PDMS stamp
after
Micro-Contact Printing (µCP) VI Direct... & subtractive C. Packard et al., Langmuir 2011, 27, 9073–9076
Applicable also to evaporated/solid films! Controllable thickness, depending on contact time
Nanometer-scale accuracy of thickness control!
16
Micro Transfer Molding
A liquid polymer precursor is poured in the cavities of the elastomeric mold, put in contact with the substrate and finally cured. Polymer must not shrink too much after curing Typical materials: polyurethane, polyacrylates and epoxies
3D structures
A: polyurethane on Ag, B,C,D: epoxy on glass
Microstructures of glassy carbon
Whitesides et al., Angew. Chem. Int. Ed. 1998, 37, 550 -575
Micro Molding in Capillaries I Based on the flow of a liquid in capillaries Flow dynamics:
2R
L Z
Z: length of the liquid column into the capillary
dZ R lv cos dt 4Z
: liquid viscosity lv: liquid-vapor surface energy
θ: liquid-capillary surface contact angle
Whitesides et al., Angew. Chem. Int. Ed. 1998, 37, 550 -575
Pisignano et Al., Adv. Mater. 14, 1565, (2002)
17
Micro Molding in Capillaries II EXAMPLE 1
EXAMPLE 2
FEATURES 300nm
Ag nanodispersion (AFM image) A. Blumel et al., Organic Electronics 8, 389–395, (2007)
• Examples: Polyurethane in PDMS mold EXAMPLE 3
PEDOT:PSS as S/D contacts in all organic TFTs H. Kang et al., Organic Electronics 10, 527–531, (2009)
Nano Imprint Lithography/Embossing I Similar to SL but based on hard mold/stamp. I It allows obtaining smaller features ( 10 nm)
T>Tg Tg: polymer glass phase transition
Hot Embossing
Room Temperature NIL
18
Nano Imprint Lithography/Embossing II Example. Nanometer-sized electrodes for OTFTs Silicon stamp - Nanoimprint of photoresist (a,b,c) - Dry etching in O2 plasma (d) - Metallization Au/Ti (e) - Lift-off in acetone (f)
O2 d
100 nm
Kam et al., Microelectronic Engineering, 73, 809–813, 2004.
Physical Delamination Based on a photolithographic process previous to semiconductor deposition
Polymer adhere to the substrate where OTS is not present
Optical and AFM images of patterned PBTTT Sirringhaus, Adv. Mater., 21, 1–6, 2009.
19
Photopatterning Same principles of standard photo-lithography resist is the active material! UV
Mask
Active material
Etching (solvent) UV-Crosslinkable
Example: patterning of pixel in OLED display: Patterning of the hole transport layer Feature size 5 m
Nuyken et Al., Macromol. Rapid Commun., 25, 1191–1196, 2004.
Non-soluble materials: deposition techniques • Vacuum Thermal Evaporation • Organic Vapor Phase Deposition (OVPD) • Organic Molecular Beam Deposition (OMBD)
20
Vacuum Thermal Evaporation I Sublimation of small molecules due to high-vacuum and high temperature
Substrate holder Pressure 10-5-10-7 torr
“Source boat”: contains the material and it is heated at hundreds of °C
Molecules mean free path: tens of cm - m •Evaporated molecules travel in straight lines inside the chamber and they condense on the substrate •Growth rate controlled by tuning the temperature of the source boat
Thickness of the film is monitored with the crystal microbalance (change of the resonating frequency of a piezo resonator).
Vacuum Thermal Evaporation I Growth rate and substrate temperature affect film morphological order PC on thermal SiO2
Pentacene on SiO2 Dimitrakopoulos, Adv. Mater., 14, 99, (2002)
High quality, ordered thin films Good control and reproducibility of film thickness Multilayer deposition and codeposition of several organic materials
PC on sputtered palladium
X Waste of material X Expensive equipments X Very low throughput high production costs X No large area coverage
21
Organic Vapor Phase Deposition Based on low pressure carrier gas instead of high vacuum
Hot inert carrier gas (Ar, N2) transport source material to the cooled substrate where condensation occurs Heated walls vapor does not condense
OVPD: working regimes Evaporation regimes Equilibrium evaporation:
Kinetic evaporation:
Organic evaporation limited by the evaporation rate
Organic evaporation limited by the flow of the carrier gas
Deposition regimes Equilibrium limited: Substrate kept at a temperature high enough to establish an adsorption/desorption equilibrium
Transport limited: Substrate at room temperature Better morphology
22
OVPD: examples TFT based on Pentacene
TPD-Alq3 OLED heterostructure SiO2-OTS
SiO2
TPD
Alq3
Shtein et al. Appl. Phys. Lett., 81, No. 2 (2002)
Forrest et Al., Appl. Phys. Lett., 71 (21), (1997)
• Advantages over standard VTE: Higher deposition rates Less waste of material (no condensation on the internal walls) Better film thickness control and uniformity in large area substrates
Organic Molecular Beam Deposition Flow of focalized molecules in ultra high vacuum Substrate
Quartz microbalance
Extremely slow deposition rate epitaxial growth Single crystal
pC ,TC
10-9 mbar
“Pin hole”
pH ,TH Effusion cell (Knudsen)
Shutter
23
Non-soluble materials: patterning techniques • Shadow masking • Vapor Jet Printing
Shadow masking Shadow mask (same principle of screen printing). Resolution limited to tens of m.
Patterning of RGB subpixels in OLED displays Fukuda et Al., Synthetic Metals, 111–112 (2000)
24
Organic Vacuum Jet Printing (OVJP) Organic small molecule material carried by hot inert gas to a nozzle array that collimates the flow into jets Condensation onto a proximally located cold substrate, that can moove relatively to the print-head for patterning
For high resolution (~20μm): •Narrow nozzles ~10μm •Low gas flow rate Fabricated by MEMS processing G.J. McGraw, Appl. Phys. Lett. 98, 013302, 2011.
Organic Vacuum Jet Printing (OVJP) 6 tubes with different source material
Fluorescence from Alq3 stripes
N2 flow rate x=feature size substrate-nozzle distance
25