• Author / Uploaded
• Rene Gonzales

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• Ingenieria Eléctrica
• Electromagnetismo
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4C0001X0.1L2 TECH INFO

1/13/05

12:15 PM

Page 20

A TECHNICAL INFORMATION P P ANSI/TIA/EIA-607 E N Design Considerations ANSI/TIA/EIA-607 D Solid copper grounding busbars (1/4" thick ¥ 4" high ¥ variable length) This standard specifies a uniform telecommunications grounding and I bonding are installed with insulated standoffs in entrance facilities and the equipment infrastructure that shall be followed within commercial buildings. room, as well as each telecom room (1/4" thick ¥ 2" high ¥ variable length is X Following the AT&T divestiture of 1984, the end-user became responsible for sufficient here). Each busbar is drilled with rows of holes according to NEMA all premises cabling for voice and data. Advancements in voice communications and the convergence of voice and data communications led to increasingly complex interactive systems owned and maintained by the end-user. These systems require a reliable electrical ground-reference potential. Grounding by attachment to the nearest piece of iron pipe is no longer satisfactory to provide ground-reference for sophisticated active electronics systems.

Contents

standards, for attachment of bolted compression fittings. Telecommunications equipment, frames, cabinets and voltage protectors are typically grounded to these busbars. Busbars are connected by a backbone of insulated, solid copper cable between all closets and rooms (minimum 6 AWG, 3/0 AWG recommended). This backbone is connected to a main grounding busbar in the telecommunications entrance facility, to an earth ground in the electrical entrance facility and to structural steel on each floor. Bonding conductor cabling shall be colored green or labeled appropriately.

Terms • Telecommunications Main Grounding Busbar (TMGB) • Telecom Bonding Backbone (TBB) • Telecom Grounding Busbar (TGB) • Telecom Bonding Backbone Interconnecting Bonding Conductor

ANSI/TIA/EIA-607 Commercial Building Grounding And Bonding Requirements For Telecommunications

(TBBIBC)

Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Schematic of Grounding/Bonding Network

Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Schematic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

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