TN0104 Low Threshold N-Channel Enhancement-Mode Vertical DMOS FETs Ordering Information Order Number / Package BVDSS /
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TN0104 Low Threshold N-Channel Enhancement-Mode Vertical DMOS FETs Ordering Information Order Number / Package
BVDSS / BVDGS
RDS(ON) (max)
VGS(th) (max)
ID(ON) (min)
TO-92
TO-243AA*
Die†
40V
1.8Ω
1.6V
2.0A
TN0104N3
—
TN0104ND
40V
2.0Ω
1.6V
2.0A
—
TN0104N8
—
7
* Same as SOT-89. †
Product supplied on 2000 piece carrier tape reels. MIL visual screening available
Product marking for TO-243AA:
Features
TN1L*
Low threshold —1.6V max.
Where *=2-week alpha date code
High input impedance Low input capacitance Fast switching speeds
Low Threshold DMOS Technology
Low on resistance
These low threshold enhancement-mode (normally-off) transistors utilize a vertical DMOS structure and Supertex’s well-proven silicon-gate manufacturing process. This combination produces devices with the power handling capabilities of bipolar transistors and with the high input impedance and positive temperature coefficient inherent in MOS devices. Characteristic of all MOS structures, these devices are free from thermal runaway and thermally-induced secondary breakdown.
Free from secondary breakdown Low input and output leakage Complementary N- and P-channel devices
Applications
Supertex’s vertical DMOS FETs are ideally suited to a wide range of switching and amplifying applications where very low threshold voltage, high breakdown voltage, high input impedance, low input capacitance, and fast switching speeds are desired.
Logic level interfaces – ideal for TTL and CMOS Solid state relays Battery operated systems Photo voltaic drives
Package Options
Analog switches General purpose line drivers Telecom switches
D
Absolute Maximum Ratings
G
Drain-to-Source Voltage
BVDSS
Drain-to-Gate Voltage
BVDGS
TO-243AA (SOT-89)
± 20V
Gate-to-Source Voltage Operating and Storage Temperature
D S
SGD
TO-92
-55°C to +150°C
Soldering Temperature*
300°C Note: See Package Outline section for dimensions.
* For TO-39 and TO-92, distance of 1.6 mm from case for 10 seconds. 7-31
TN0104
Thermal Characteristics Package
ID (continuous)*
ID (pulsed)
Power Dissipation @ TC = 25°C
°C/W
°C/W
θja
IDR*
IDRM
0.80A
2.40A
1.0W
125
170
0.80A
2.40A
2.90A
1.6W†
15
78†
1.40A
2.90A
TO-92 TO-243AA
1.40A
θjc
* ID (continuous) is limited by max rated Tj. TA = 25°C. Mounted on FR5 Board, 25mm x 25mm x 1.57mm. Signficant P D increase possible on ceramic substrate.
Electrical Characteristics Symbol
(@ 25°C unless otherwise specified)
Parameter
Min
BVDSS
Drain-to-Source Breakdown Voltage
40
VGS(th)
Gate Threshold Voltage
0.6
∆VGS(th)
Change in VGS(th) with Temperature
IGSS
Gate Body Leakage
IDSS
Zero Gate Voltage Drain Current
ON-State Drain Current
ID(ON)
RDS(ON)
Static Drain-to-Source ON-State Resistance
Typ
Max
VGS= 0V, ID = 1.0mA
1.6
V
VGS = VDS, ID = 500µA
-3.8
-5.0
mV/°C
VGS = VDS, ID = 1.0mA
0.1
100
nA
VGS = ±20V, VDS = 0V
1
µA
VGS =0V, VDS = Max Rating
100
µA
VGS = 0V, VDS = 0.8 Max Rating TA = 125°C
0.35
VGS = 3V, VDS = 20V
1.1
2.0
2.6
VGS = 10V, VDS = 20V
5.0
VGS = 3V, ID = 50mA
A
2.3
2.5
TO-92
1.5
1.8
Change in RDS(ON) with Temperature
VGS = 5V, VDS = 20V
0.5
All Packages
∆RDS(ON)
Conditions
V
TO-243AA
VGS = 5V, ID = 250mA Ω
0.7 0.34
1.0
GFS
Forward Transconductance Input Capacitance
70
COSS
Common Source Output Capacitance
50
CRSS
Reverse Transfer Capacitance
15
td(ON)
Turn-ON Delay Time
3.0
5.0
tr
Rise Time
7.0
8.0
td(OFF)
Turn-OFF Delay Time
6.0
9.0
tf
Fall Time
5.0
8.0
VSD
Diode Forward
TO-92
1.2
1.8
Voltage Drop
TO-243AA
%/°C
VGS =10V, ID = 1A, VDS = 20V, ID = 0.5A
pF
VGS = 0V, VDS = 20V f = 1 MHz
ns
VDD = 20V, ID = 1A RGEN = 25Ω
0.45
VGS = 0V, ISD = 1.0A
2.0
Reverse Recovery Time
VGS = 10V, ID = 1A VGS = 10V, ID = 1A
2.0
CISS
trr
Unit
Ω
†
300
V
VGS = 0V, ISD = 0.5A
ns
VGS = 0V, ISD = 1A
Notes: 1. All D.C. parameters 100% tested at 25°C unless otherwise stated. (Pulse test: 300µs pulse, 2% duty cycle.) 2. All A.C. parameters sample tested. VDD
Switching Waveforms and Test Circuit RL
10V 90%
PULSE GENERATOR
INPUT 0V
10% t(ON) td(ON)
t(OFF) tr
td(OFF)
OUTPUT
Rgen
tF D.U.T.
VDD
10%
INPUT
10%
OUTPUT 0V
90%
90%
7-32
TN0104
Typical Performance Curves Output Characteristics
Saturation Characteristics
3.75
3.75
3.0
VGS = 10V
2.25
ID (amperes)
ID (amperes)
3.0
8V 1.5
6V
0.75
4V
VGS = 10V
2.25
8V 1.5
6V
0.75
4V
2V
2V
0
0 0
10
20
30
40
0
50
2
4
VDS (volts)
TA = -55 ° C
4
0.60
TA = 25° C
0.45
PD (watts)
GFS (siemens)
10
5
VDS = 25V -25V
TA = 125 ° C 0.30
3
TO-243AA (T A = 25°C)
2
TO-92
1
0.15
0
0 0
0.5
1.0
1.5
2.0
0
2.5
25
50
75
125
100
150
TC (° C)
ID (amperes)
Thermal Response Characteristics
Maximum Rated Safe Operating Area 10
Thermal Resistance (normalized)
1.0
TO-39 (DC)
ID (amperes)
8
Power Dissipation vs. Case Temperature
Transconductance vs. Drain Current 0.75
1.0
6
VDS (volts)
TO-92 (DC) TO-243AA (DC) (T A = 25°C)
0.1
0.01 0.1
1
10
0.8
0.6
0.4
VDS (volts)
TO-92 P D = 1W T C = 25°C
0.2
0 0.001
100
TO-243AA TA = 25°C PD = 1.6W
0.01
0.1
tp (seconds)
7-33
1
10
7
TN0104
Typical Performance Curves BVDSS Variation with Temperature
On-Resistance vs. Drain Current 10
1.3
V GS = 5V 8
RDS(ON) (ohms)
1.1
1.0
6
VGS = 10V
4
2
0.9
0
0.8 -50
0
50
100
1
0
150
Tj (° C) Transfer Characteristics 3.0
V(th) and RDS Variation with Temperature
TA = -55 ° C
1.4
1.4
1.2
1.2
25 ° C
VDS = 25V
1.8
VGS(th) (normalized)
2.4
ID (amperes)
2
ID (amperes)
125° C
1.2
1.0
RDS(ON) @ 5V, 0.25A
0.8
0.8
V(th) @ 0.5mA
0.6
0.6
0
0.6
0.4 0
2
4
6
8
0.4 -50
10
1.0
0
50
100
150
Tj (° C)
VGS (volts) Capacitance vs. Drain-to-Source Voltage
Gate Drive Dynamic Characteristics 10
100
VDS = 10V
f = 1MHz 8
55pF
VGS (volts)
C (picofarads)
75
CISS 50
40V 6
4
COSS
25
2
CRSS
50pF
0
0 0
10
20
30
0.5
40
0.65
0.8
0.95
QG (nanocoulombs)
VDS (volts)
7-34
1.1
1.25
RDS(ON) (normalized)
BVDSS (normalized)
1.2