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ZXSDR B8200 Product Description

ZXSDR B8200 Product Description

ZXSDR B8200 Product Description Version

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© 2017 ZTE Corporation. All rights reserved. ZTE CONFIDENTIAL: This document contains proprietary information of ZTE and is not to be disclosed or used without the prior written permission of ZTE. Due to update and improvement of ZTE products and technologies, information in this document is subjected to change without notice.

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ZXSDR B8200 Product Description

TABLE OF CONTENTS

2

1 1.1 1.2 1.3

Overview ............................................................................................................ 6 Introduction .......................................................................................................... 6 Benefits................................................................................................................ 6 Application Scenarios .......................................................................................... 7

2 2.1 2.2 2.2.1 2.2.2 2.2.3 2.2.4 2.2.5 2.2.6 2.2.7 2.2.8 2.2.9 2.3 2.4

Product Architecture ......................................................................................... 9 Physical Structure ................................................................................................ 9 Hardware Structure ............................................................................................ 10 Control & Clock Board (CC) ............................................................................... 10 Baseband Processing Board .............................................................................. 14 Fabric Switch Board (FS) ................................................................................... 19 Site Alarm Board (SA/SE) .................................................................................. 21 Universal Ethernet Switch Board (UES) ............................................................. 23 Universal Clock Interface Board (UCI/UCI-C)..................................................... 24 Tower mounted Amplifier control Module (TAM) ................................................ 24 Power Module (PM) ........................................................................................... 26 Fan Array Module (FAM) .................................................................................... 27 Software Architecture ......................................................................................... 27 Functionality....................................................................................................... 29

3 3.1 3.2 3.3 3.3.1 3.3.2 3.4 3.5 3.6 3.7

Technical Specifications ................................................................................. 30 Physical Indices ................................................................................................. 30 Capacity Indices ................................................................................................ 30 Power Indices .................................................................................................... 31 Power Supply..................................................................................................... 31 Power Consumption........................................................................................... 31 Interface Indices ................................................................................................ 32 Environment Indices .......................................................................................... 33 Electromagnetic Compatibility Indices ................................................................ 34 Reliability Indices ............................................................................................... 34

4

Configurations Principles ............................................................................... 35

5 5.1 5.2 5.3 5.4

Site Support Cabinets for B8200 .................................................................... 37 BC8910B/BC8911B ........................................................................................... 37 BC8910A ........................................................................................................... 38 ZXSDR BS8906 ................................................................................................. 39 Physical Indices ................................................................................................. 40

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ZXSDR B8200 Product Description

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Glossary ........................................................................................................... 41

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ZXSDR B8200 Product Description

FIGURES Figure 1-1 B8200 in the GSM/UMTS/LTE Network ............................................................. 6 Figure 1-2 B8200 Application Scenario ............................................................................... 8 Figure 2-1 Baseband Unit -- ZXSDR B8200 ........................................................................ 9 Figure 2-2 B8200 Hardware Structure ...............................................................................10 Figure 2-3 CC Panel ..........................................................................................................10 Figure 2-4 UBPG/UBPG3 Panel ........................................................................................14 Figure 2-5 BPK_e1/BPK_e/BPK_d Panel ..........................................................................15 Figure 2-6 BPN0A/BPN0 Panel .........................................................................................16 Figure 2-7 BPN2 Panel ......................................................................................................18 Figure 2-8 FS Panel ...........................................................................................................19 Figure 2-9 SA Panel...........................................................................................................21 Figure 2-10 SE Panel.........................................................................................................22 Figure 2-11 UES Panel ......................................................................................................23 Figure 2-12 UCI/UCI-C Panel ............................................................................................24 Figure 2-13 TAM Panel ......................................................................................................25 Figure 2-14 PM Panel ........................................................................................................26 Figure 2-15 FAM Panel ......................................................................................................27 Figure 2-16 B8200 Software Structure ...............................................................................28 Figure 5-1 Physical Structure of BC8910B/BC8911B .........................................................37 Figure 5-2 Physical Structure of BC8910A (AC Power Supply) ..........................................38 Figure 5-3 Physical Structure of BC8910A (DC Power Supply) ..........................................39 Figure 5-4 Physical Structure of ZXSDR BS8906 Standalone Cabinet ..............................39

TABLES Table 2-1 Board List of ZXSDR B8200................................................................................ 9

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ZXSDR B8200 Product Description

Table 2-2 Key Indices of CC Boards ..................................................................................11 Table 2-3 CC2/CC16B Panel Interfaces.............................................................................12 Table 2-4 CCE1 Panel Interfaces.......................................................................................12 Table 2-5 Key Indices of BPK_e1/BPK_e /BPK_d ..............................................................15 Table 2-6 Key Indices of BPN0A/BPN0..............................................................................17 Table 2-7 BPN0A/BPN0 Panel interfaces ..........................................................................17 Table 2-8 Key Indices of BPN2 ..........................................................................................18 Table 2-9 BPN2 Panel interfaces .......................................................................................19 Table 2-10 Key Indices of FS boards .................................................................................20 Table 2-11 FS Panel Interfaces .........................................................................................20 Table 2-12 SA Panel Interfaces .........................................................................................21 Table 2-13 SE Panel Interfaces .........................................................................................22 Table 2-14 UES Panel Interfaces .......................................................................................23 Table 2-15 UCI/UCI-C Panel Interface ...............................................................................24 Table 2-16 TAM Panel Interfaces.......................................................................................25 Table 2-17 PM Panel Interfaces .........................................................................................26 Table 3-1 Physical Indices .................................................................................................30 Table 3-2 BS8200 Capacity ...............................................................................................30 Table 3-3 B8200 Power Supply .........................................................................................31 Table 3-4 ZXSDR B8200 Power consumption ...................................................................31 Table 3-5 ZXSDR BS8200 Interface Indices ......................................................................32 Table 3-6 B8200 Working Environment Characteristics .....................................................33 Table 3-7 ZXSDR B8200 Electromagnetic Compatibility Characteristics............................34 Table 3-8 B8200 Reliability Characteristics ........................................................................34 Table 4-1 B8200 Configuration ..........................................................................................35 Table 5-1 Site Support Cabinet Physical Indices ................................................................40

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ZXSDR B8200 Product Description

1

Overview

1.1

Introduction This document provides a high level description of the distributed baseband processing Unit (BBU) ZXSDR B8200 (hereinafter B8200) that used in ZTE multi-mode wireless solutions. The baseband unit B8200, can be inserted into the integrated macro base station, or connected to RRU in distributed base station. It is responsible for processing the baseband signals. Based on ZTE SDR platform, it supports GSM, UMTS and FDD LTE single-mode or multi-mode by software configuration. It enables operators to deploy one unified radio access network rather than independent GSM, UMTS or LTE/LTE-A network, which brings simplicity and convenience with low CAPEX and OPEX. Figure 1 shows the position of the ZXSDR B8200 in the typical multi-mode network. Figure 1-1

B8200 in the GSM/UMTS/LTE Network

This document is structured as follows. Chapter 1 provides an overview of the characteristics of B8200, its key benefits and application scenarios. Chapter 2 gives the architecture, functionality, services and multi-system cooperation. Chapter 3 covers system capabilities, and chapter 4 introduces configuration principles of each kind of boards used in B8200.

1.2

Benefits 

6

Multi-mode Baseband Unit

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ZXSDR B8200 Product Description

B8200 supports all kinds of wireless access technologies simultaneously, including GSM, UMTS and LTE, which share the common control function and transmission totally. It fully satisfies operators’ need with the minimum hardware change. 

Large Capacity To adapt to the rapid expansion of network development and the prosperity of multi-mode network, the latest BBU boards are released with higher processing capacity. The capacity indices of new boards surpass legacy ones, including RRC connected user number, cell number and data throughput. The increase in the board capacity improves the overall capacity of BBU. In addition, the new boards can be used together with the legacy ones, which provide flexibility during upgrade.



Plug-in Design for Shelf, Zero Footprint, Convenient Deployment B8200 adopts Plug-in design with 19-inch, 2U in height and 8.75 kg (with full configuration) in weight. It can be conveniently mounted on the wall, ground, or in the 19-inch rack, etc.



Flexible Networking B8200 provides GE/FE interfaces and IP networking. It supports RRU in different networking modes, like star and chain networking to satisfy the requirements of operators in different environments and under different transmission conditions.

1.3

Application Scenarios As the baseband processing unit, B8200 is widely used in ZTE series of base stations, including indoor macro BS of ZXSDR BS8800, outdoor macro BS of ZXSDR BS8900A/BS8900B, distributed BS of ZXSDR BS8700 and outdoor compact BS of ZXSDR BS8906. Typical application scenarios of B8200 are shown in the following figure.

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ZXSDR B8200 Product Description

Figure 1-2

B8200 Application Scenario

RRU Installation

RRU

B8200 Accommodation

B8200

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ZXSDR B8200 Product Description

2

Product Architecture

2.1

Physical Structure The following figure shows the hardware appearance of B8200.

Figure 2-1

Baseband Unit -- ZXSDR B8200

1

3

4

5 2 6

1. Power module (PM) 2. Site alarm board (SA) 3. Fabric switch board (FS) 4. Baseband processing board (BP) 5. Fan array module (FAM) 6. Control & clock board (CC)

The baseband unit consists of control & clock board, fabric switch board, baseband processing board, site alarm board, site alarm extension board (optional), universal Ethernet switch (optional), tower mounted amplifier control module (optional), power module, and fan module.

Table 2-1

Board List of ZXSDR B8200 Board Name

Function Description

CC2/CC16B/CCE1

Control & Clock Board

FS3/FS3A/FS5/CR0

Fabric Switch Board

UBPG/UBPG3

Universal Baseband Processing board for GSM

BPK_e1/BPK_e/BPK_d

Base band Processing board for UMTS

BPN0A/BPN0

Base band Processing board for LTE

BPN2

Baseband Processing board for GUL multi-mode

SA

Site Alarm Board

SE

Site alarm Extension Board

UES

Universal Ethernet Switch Board

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ZXSDR B8200 Product Description

2.2

UCI

Universal Clock Interface

TAM

Tower mounted Amplifier control Module

PM

Power Module

FAM

Fan Array Module

Hardware Structure B8200 hardware architecture is shown in Figure 2-2.

Figure 2-2

B8200 Hardware Structure

Baseband Unit

Antenna

Baseband Processing

FS (Optional

CPRI RRU/RSU

for LTE) SA/ E1

SE

CC Radio Unit

GE/FE Control Signaling Clock Data

B8200 can be configured in GSM/UMTS/LTE single mode or multi-mode.

2.2.1

Control & Clock Board (CC) CC is the control & clock board, used for control and management of baseband unit, providing Ethernet and system clock. There are mainly 3 types of CC boards in order to meet different application requirements, illustrated in the following figures.

Figure 2-3

CC Panel

CC2:

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ZXSDR B8200 Product Description

CC16B:

CCE1:

Note: The boards are differentiated by the label attached on the panel, not included in the above figures. The product you receive is subject to the actual object.

Their key indices are specified in the following table.

Table 2-2

Key Indices of CC Boards

CC Type Mode

CC2

CC16B

CCE1

G/U single mode

G/U/L single mode or

GUL multi-mode or

or dual-mode

multi-mode

LTE single mode

400/s

1500/s

3000/s

N/A

10800

10800

Processing

RRC_connected users

RRC_connected users

Capability

UL: 900Mbps/ DL:

UL: 1.8Gbps/ DL:

900Mbps

3.6Gbps

UMTS CNBAP Processing Capability LTE

Note: 1. The above table describes the maximum hardware capability. The actual capability is up to the licenses configured. 2. There is the GPS module embedded in CC16B/CCE1 but not in CC2.

The panel interfaces are specified in the following table.

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ZXSDR B8200 Product Description

Table 2-3

CC2/CC16B Panel Interfaces

Interface Name

Description External communication port, connected to external

EXT

receiver for clock synchronization or cascading. Connected to GPS signal interface, or 2 MHz BITS signal

REF

interface.

USB (CC16B only)

Used for software upgrade Ethernet interface for Abis/Iub/S1/X2, self-adaptive

TX RX

100M/1000M optical interface. Ethernet interface for Abis/Iub/S1/X2, self-adaptive

ETH0

10M/100M/1000M electrical interface.

DEBUG/CAS/LMT

Ethernet interface used for cascading, debugging or local maintenance, adapting interface of 10M/100M/1000M.

Note: Interfaces of ETH0 and TX RX are mutually exclusive.

Table 2-4

CCE1 Panel Interfaces

Interface Name ETH0

ETH1

DEBUG/LMT

TX ETH2 RX

TX ETH3 RX

REF USB EXT

Description Ethernet interface for Abis/Iub/S1/X2, self-adaptive 10M/100M/1000M electrical interface. Ethernet interface used for cascading, adapting interface of 10M/100M/1000M electrical interface. Ethernet interface used for debugging or local maintenance, adapting interface of 10M/100M/1000M. Ethernet interface for Abis/Iub/S1/X2, self-adaptive 1000M/10000M optical interface. Ethernet interface for Abis/Iub/S1/X2, self-adaptive 1000M/10000M optical interface. Connected to GPS signal interface, or 2 MHz BITS signal interface. Used for software upgrade External communication port, connected to external receiver for clock synchronization or cascading.

Their main functions are listed as follows:

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ZXSDR B8200 Product Description



Accomplishes LTE control plane protocol processing, including S1AP, X2AP, RRC, etc.



Supports Ethernet switching function and implements data switching for service and control flow within the system



Support aggregating traffic for switch which can be used for microwave, PDH, Ethernet.



Processes Abis/Iub/S1/X2/O&M interface protocol



Manages software versions of boards and programmable components, and supports local and remote software upgrade



Reads various hardware management marks in the system, including the rack number, backplane type number, slot number, board function type, board version, and board function configuration mark



Monitors, controls and maintains the base station system with LMT interface



Supervises the running status of each board within the system



Supports primary/slave switchover



Synchronizes with various external reference clocks, including

IEEE1588, GPS

clock and the clock provided by BITS(2MHz、2Mbits). The CC can select one according to the actual configuration 

Generates and delivers the clock signal demanded by each part



Provides GPS receiver interface and manages the GPS receiver



Provides a real-time clock for system operation and maintenance and calibrates the real-time clock



Supports MicroTCA protocol based module management function



Supports 2 CC boards for different modes: one for GU dual-mode and the other for LTE mode

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ZXSDR B8200 Product Description

In addition, CC16B/CCE1 has the following functions:

2.2.2



Supporting Synchronous Ethernet clock



Providing USB interface for software upgrade

Baseband Processing Board There are 3 categories of baseband processing boards in order to meet different application requirements: 1.

UBPG /UBPG3

Both UBPG and UBPG3 are GSM baseband processing boards, processing the physical layer protocol and frame protocol specified by 3GPP, illustrated in the following figure.

Figure 2-4

UBPG/UBPG3 Panel

Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.

UBPG supports 12 TRXs and UBPG3 supports 24 TRXs. Their main functions are listed as follows: 

Supports rate adaptation, channel coding, interleaving, encryption, TDMA shock burst generation, GMSK/8PSK modulation, and IQ baseband digital signals output



Supports uplink IQ data receiving, receiver diversity combination, digital demodulation (GMSK&8PSK, equilibrium), decryption, deinterleaving, demodulator, rate adaptation, and transmits signals from GE Ethernet interfaces to CC board for processing

14



Synchronizes radio link and processes transmission frame



Measures parameters required in power control and handover

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ZXSDR B8200 Product Description



Supports diversified transmission and receiving



Communicates with CC via Ethernet interface



Reads all the hardware management identifiers, including the backplane type number, slot number, board function type, board version, board function configuration identifier, and the CPU serial number

2.

BPK_e1/BPK_e/BPK_d

BPK_e1, BPK_e and BPK_d are all UMTS baseband processing boards, processing the physical layer protocol and frame protocol specified by 3GPP, illustrated in the following figure.

Figure 2-5

BPK_e1/BPK_e/BPK_d Panel

Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.

They provide the same functions but with different CE, cell processing capability and data throughput. The key indices are specified in the following table.

Table 2-5

Key Indices of BPK_e1/BPK_e /BPK_d

Board

BPK_e1

BPK_e

BPK_d

CSs

6

6

12

CE No.

DL192CE/UL19

DL384CE/UL384CE

DL768CE/UL768CE

2CE Data

DL129.6Mbps/

DL259.2Mbps/

DL518.4Mbps/

Throughput

UL34.5Mbps

UL69Mbps

UL138Mbps

Note: The above table describes the maximum hardware capability. The actual capability is up to the licenses configured.

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ZXSDR B8200 Product Description

Their main functions are listed as follows: 

Achieves downlink baseband signal processing, including downlink data coding, multiplexing, rate adaptation, channel mapping, spread spectrum and scrambling power regulation and channel compositing



Achieves uplink baseband signal processing, including uplink data RAKE receiving, demodulator, and transmits data to lub interface for processing



Supports A-RAKE receiving and UL interface cancellation



Supports radio link synchronization and frame processing



Measures parameters required in power control and handover



Supports softer handover and carrier diversity



Communicates with the CC via the Ethernet interface



Reads all the hardware management identifiers, including the backplane type number, slot number, board function type, board version, board function configuration identifier, and the CPU serial number

3.

BPN0A/BPN0

BPN0A/BPN0 are all LTE baseband processing boards, processing the physical layer protocol and frame protocol specified by 3GPP, illustrated in the following figure.

Figure 2-6

BPN0A/BPN0 Panel

Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.

They provide the same functions but with different CPRI interfaces, cell processing capability and data throughput. The key indices are specified in the following table.

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ZXSDR B8200 Product Description

Table 2-6

Key Indices of BPN0A/BPN0 Board

BPN0A

BPN0

CPRI Interfaces

6 pairs

6 pairs

RRC_connected Users

3600

3600

Cells (20MHz, 2T2R/2T4R)

3

6

Cells (20MHz, 4T4R)

N/A

3

Data Throughput

DL450Mbps/

DL600Mbps/

UL225Mbps

UL300Mbps

Note: The above table describes the maximum hardware capability. The actual capability is up to the licenses configured.

The panel interfaces are specified in the following table.

Table 2-7

BPN0A/BPN0 Panel interfaces

Board Type

Interface

BPN0A/BPN0

TX0 RX0 ~ TX5 RX5

Description 6 pairs of CPRI optical/electrical interfaces, connected to RRU/RSU

Their main functions are listed as follows: 

Processes physical layer protocol



Provides uplink/downlink I/Q signal



Supports MAC, RLC and PDCP protocol

4.

BPN2

BPN2 is a GSM/UMTS/LTE multi-mode baseband processing board, integrating all the functions provided by the G/U/L single mode BP boards. It can be configured as G/U/L single mode or multi-mode, illustrated in the following figure.

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ZXSDR B8200 Product Description

Figure 2-7

BPN2 Panel

Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.

They provide the same functions but with different processing capabilities. The key indices are specified in the following table.

Table 2-8

Key Indices of BPN2 Board

BPN2

CPRI Interfaces

6 pairs

GSM

72 TRXs

UMTS

12 CSs(1024CEs) DL 518.4Mbps/UL 138Mbps 12 2T2R/2T4R Cells or 6 4T4R Cells

LTE

7200 RRC_connected Users 450 VoLTE users one cell DL 1200Mbps/UL 600Mbps 12 TRXs + 12 CSs(768CEs)

GU dual-mode

24 TRXs + 9 CSs(640CEs) 36 TRXs + 6 CSs(512CEs) 48 TRXs + 6 CSs(256CEs)

GL dual-mode

36 TRXs + 6 Cells

UL dual-mode

6 CSs(512CEs) + 6 Cells

GUL multi-mode Bandwidth support

12 TRXs + 6 CSs(256CEs) + 6 Cells 24 TRXs + 3 CSs(128CEs) + 6 Cells 1.4MHz, 3MHz, 5MHz, 10MHz, 15MHz, 20MHz

Note: The above table describes the maximum hardware capability. The actual capability is up to the licenses configured.

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ZXSDR B8200 Product Description

The panel interfaces are specified in the following table.

Table 2-9

BPN2 Panel interfaces

Board Type BPN2

2.2.3

Interface TX0 RX0 ~ TX5 RX5

Description 6 pairs of CPRI optical/electrical interfaces, connected to RRU/RSU

Fabric Switch Board (FS) FS is fabric switch board which provides the optical interface between BBU and RRU and processes the IQ signal. There are 5 types of FS boards, illustrated in the following figure.

Figure 2-8

FS Panel

FS3:

FS3A:

FS5:

FS5A:

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ZXSDR B8200 Product Description

CR0:

Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.

Their key indices are specified in the following table.

Table 2-10

Key Indices of FS boards

FS Type

Mode

FS3

FS3A

FS5

FS5A

CR0

G/U

G/U

G/U/L

G/U/L

When LTE

single

single

single

single

is included

mode or

mode or

mode or

mode or

and Cloud

dual-mod

dual-mod

multi-mode

multi-mode

Radio (CR)

e

e

6

12

12

12

12

30

48

60

60

60

1.2288/2.

1.2288/2.

1.2288/2.45

1.2288/2.45

1.2288/2.45

4576

4576

76/3.072/6.

76/3.072/6.

76/3.072/6.

144

144/9.8304

144/9.8304

is required

Max. CSs, working with one UMTS BP board Max. CSs, working with UMTS BP boards per BBU CPRI Interface Data Rate (Gbps)

The panel interfaces are specified in the following table.

Table 2-11

FS Panel Interfaces

Interface Name

20

Description

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ZXSDR B8200 Product Description

TX0 RX0 to TX5 RX5

6 pairs of optical/electrical interfaces, connected to RRU/RSU

ETH (CR0 only)

10GE Ethernet interface, connected to BBU

Their main functions are listed as follows: 

Receives the signal from the rear board in the downlink and retrieves the data and timing.



Multiplexes the received data and retrieves I/Q signal



Supports I/Q mapping in the downlink and multiplexes I/Q signal to the optical signals

2.2.4



Receives the I/Q in uplink and de-multiplexes/maps into I/Q signal



Transmits the multiplexed I/Q signal to baseband processing board



Exchanges the CPU interface signaling through HDLC interface with RU module

Site Alarm Board (SA/SE) 1.

Site Alarm Board (SA)

SA is a site alarm board, illustrated in the following figure.

Figure 2-9

SA Panel

Note: The product you receive is subject to the actual object.

There are two types of SA boards with different number of interfaces, as specified in the following table.

Table 2-12

SA Panel Interfaces

Interface Name

ZTE Confidential & Proprietary

SA0

SA3

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ZXSDR B8200 Product Description

Interface Name -

SA0

SA3

8 E1/T1 interfaces

4 E1/T1 interfaces

6+2 dry contacts (6 input, 2

14+2 dry contacts (14 input, 2

bidirectional)

bidirectional)

1 RS485 interface

1 RS485 interface

1 RS232 interface

1 RS232 interface

The SA has the following functions: 

Provides E1/T1 transmission interfaces



Provides site alarm monitoring interfaces



Provides FAM's alarm and rate control



Supports signal monitoring and interface lightning protection



The last E1 used for E1 transmission or BITS-2MHz/BITS-2Mbps clock input

2.

Site alarm Extension Board (SE)

SE is site alarm extension board, and shares the bottom-right slot with baseband processing board. It is used to extend the interface number if SA cannot fulfill the requirements. The SE panel is illustrated in the following figure.

Figure 2-10

SE Panel

Note: The product you receive is subject to the actual object.

There are two types of SE boards with different number of interfaces, as specified in the following table.

Table 2-13

SE Panel Interfaces

Interface Name

22

SE0

SE2

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ZXSDR B8200 Product Description

Interface Name -

SE0

SE2

8 E1/T1 interfaces

4 E1/T1 interfaces

6+2 dry contacts (6 input, 2

14+2 dry contacts (14 input, 2

bidirectional)

bidirectional)

1 RS485 interface

1 RS485 interface

1 RS232 interface

1 RS232 interface

The SE board provides the following functions:

2.2.5



E1/T1 transmission interfaces



Site alarm monitoring interfaces

Universal Ethernet Switch Board (UES) UES is used for synchronized Ethernet and the panel is illustrated in the following figure. Figure 2-11

UES Panel

Note: The product you receive is subject to the actual object.

Description of UES panel interfaces is specified in the table below: Table 2-14

UES Panel Interfaces

Interface Name

Description

X1 ~ X2

The electrical interfaces for cascaded connection.

X3/UPLINK

A compatible electrical interface for both cascaded connection and uplink connection for link aggregation.

UPLINK

An electrical or optical interface.

X4/UPLINK

A compatible optical interface for both cascaded connection and uplink connection for link aggregation.

UES has the following functions:

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ZXSDR B8200 Product Description

2.2.6



Supports L2 Ethernet switch



Supports synchronous Ethernet clock

Universal Clock Interface Board (UCI/UCI-C) UCI is the RGPS clock interface board. There are two types of UCI boards: UCI and UCI-C. UCI/UCI-C panel is illustrated in Figure 2-12.

Figure 2-12

UCI/UCI-C Panel

Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.

Description of UCI/UCI-C panel interfaces is shown in the following table:

Table 2-15

UCI/UCI-C Panel Interface

Interface Name TX RX

Description 125Mbps optical interface, connected to RGPS equipment for signal import. TX RX is only available on UCI.

EXT

HDMI interface, providing 1PPS+TOD clock signal for the CC board in the same BBU.

REF

GLONASS/GPS antenna interface, only available on UCI-C. Reserved on UCI.

DLINK0

HDMI interface, providing 2 outputs of 1PPS+TOD signals for CC boards in other BBUs.

DLINK1

HDMI interface, providing 2 outputs of 1PPS+TOD signals for CC boards in other BBUs.

2.2.7

Tower mounted Amplifier control Module (TAM) TAM is used for tower mounted amplifier control when TMA is needed. Panel of TAM is shown as following figure.

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ZXSDR B8200 Product Description

Figure 2-13

TAM Panel

Note: The product you receive is subject to the actual object.

The panel interfaces are specified in the table below.

Table 2-16

TAM Panel Interfaces

Interface Name

Description

TA0

DC output voltage channel 0

TA1

DC output voltage channel 1

TA2

DC output voltage channel 2

TA3

DC output voltage channel 3

TA4

DC output voltage channel 4

TA5

DC output voltage channel 5

The TAM has the following functions: 

Supports working status detection of tower amplifier and reports alarm signals to CC board



Provides power on and off for tower amplifier with +28V, +12V or +13V power supply



Realizes the communication with CC board



Implements conversion, protection and filtering of power supply



Provides anti-lightning for power supply circuit



Implements software remote downloading and current threshold setting

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ZXSDR B8200 Product Description

2.2.8

Power Module (PM) PM is the power module, including PM3 and PM5. PM5 has 50% more power supply than PM3 for full configuration of new high power consumption boards, shown in the following figure.

Figure 2-14

PM Panel

PM3:

PM5:

Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.

The panel interfaces are specified in the following table.

Table 2-17

PM Panel Interfaces

Interface Name

Description

MON

Debugging interface, RS232 interface

-48V/-48VRTN

-48V input

ON/OFF (PM3 only)

Power switch, turning on/off 12V power to/from BBU

The PM has the following functions: 

26

Provides 16 internal interfaces for +12 V, +13V or +28V load power;

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ZXSDR B8200 Product Description

2.2.9



Provides 16 internal interfaces for +3.3 V management power;



Supports EMMC management;



Supports measurement and protection of input over-voltage/under-voltage;



Supports output over-current protection and load power management.

Fan Array Module (FAM) FAM is fan array module. Its panel is illustrated in the following figure.

Figure 2-15

FAM Panel

Note: The product you receive is subject to the actual object.

The FAM has the follows functions:

2.3



Monitors and controls system temperature;



Monitors, controls, and reports the fan state.

Software Architecture The software architecture of the ZXSDR B8200 can be divided into three layers:

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ZXSDR B8200 Product Description



Application software layer



Platform software layer



Hardware layer

Figure 2-16

B8200 Software Structure

GSM/UMTS/LTE Application Software

LMT NOP

SCS

OAM

BRS

DBS

OSS

OMC-B

Linux Hardware (BSP)

The application software layer provides functions as follows: 

RNLC (radio network layer control) provides common and dedicated radio resource management and control functions for control plane



RNLU (radio network layer user) provides user plane function



SCHEDULER (scheduler sub-system) provides uplink/downlink MAC scheduling



PHY (physical layer) provides PHY function

The SDR platform software provides the functions of Operation Support Sub-system (OSS), Operating And Maintenance (OAM), Data Base Sub-system (DBS), Bearer Sub-system (BRS) and System Control Sub-system (SCS): 

OSS is the support layer in this entire framework, which is a hardware independent platform for running software and provides basic functions like scheduling, timer,

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ZXSDR B8200 Product Description

memory management, communication, sequencing control, monitoring, alarming and logging. 

OAM provides the configuration, alarm and performance measurement function for base station.



DBS is the database system.



BRS provides the IP communication function for inter-board and inter-network elements.



SCS provides the power control and system management function.

Board Support Package (BSP) is the software closely connected with the board hardware and supports Real Time Operation Support Sub-system (RT OSS) to work on the board.

2.4

Functionality B8200 implements the following basic functions on Abis/Um/Uu/S1/X2 and O&M interfaces: 

Channel coding and decoding



Channel multiplexing and de-multiplexing



Baseband resource pooling function



Measurement and report



Power control



Spatial multiplexing, transmit diversity and receive diversity



Synchronization



Operation and Maintenance



DTX

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ZXSDR B8200 Product Description



Support MCPA technology



BBU support the FDD part of ETSI EN 301 908 V5.2.1 which are specifications for electromagnetic compatibility and radio spectrum matters by ESTI.

3

Technical Specifications

3.1

Physical Indices Table 3-1

3.2

Physical Indices

Item

Indices

Size (H*W*D) (mm)

88.4*482.6*197

Weight (kg)

8.75 (full configuration)

Capacity Indices Table 3-2

BS8200 Capacity

Mode GSM

Capacity 360 TRXs

BBU Configuration 1CC16B+5BPN2+1FS+2PM+1SA

60 CSs UMTS

5120 CEs UL/5120 CEs DL

1CC16B+5BPN2+1FS+2PM+1SA

690 Mbps UL /1000 Mbps DL 36 cells (1T1R/1T2R/2T2R/2T4R) LTE(2C

36 Cells (4T4R)

CE1)

2CCE1+6BPN2+2PM+1SA

21600 RRC_connnected users 3.6Gbps UL/7.2Gbps DL 12 cells LTE(1C C16B)

(1T1R/1T2R/2T2R/2T4R) 6 Cells (4T4R)

30

1CC16B+1BPN2+2PM+1SA *2PM:1+1 backup

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ZXSDR B8200 Product Description

Mode

Capacity

BBU Configuration

7200 RRC_connnected users 450 VoLTE users for one cell 900Mbps DL/600Mbps UL Note: 1. CC16B board supports GE/FE interface and thus limits the total data throughput to 1000Mbps in the physical layer (900Mbps in application layer for LTE single mode). 2. The above table describes the maximum hardware capacity. The actual capacity is up to the licenses configured.3. GUL multi-mode capacity can be calculated according the capacity of the configured CC boards and BP boards.

3.3

Power Indices

3.3.1

Power Supply B8200 power supply is shown in the following Table.

Table 3-3

B8200 Power Supply

Power Options DC: -48 V (-57 V– -38 V DC)

Description Supported by integrated PM modules

The power supply is already certified for the following markets.

3.3.2

Power Consumption The power consumption depends on traffic load, configuration and environment temperature. The following table provides power consumption of typical configuration.

Table 3-4

ZXSDR B8200 Power consumption Items

Power Consumption (W)

12 TRXs/1 UBPG

75

24 TRXs/1 UBPG3

80

6CSs/3 BPK_e/BPK_e1

85

12CSs/1 BPK_d

110

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ZXSDR B8200 Product Description

Items

3.4

Power Consumption (W)

6 cells/1 BPN0

85

24 TRXs + 3 CSs(128CEs) + 6 Cells /1 BPN2

120

12 TRXs + 6 CSs(256CEs) + 6 Cells/1 BPN2

120

Interface Indices Table 3-5

ZXSDR BS8200 Interface Indices

Interface Abis/Iub (CC2/CC16B)

Item

Indices

Type

E1/T1

8 pairs

DB44

Standard ITU G.703/G.704 ANSI T1.403

1 10M/100M/1000M electrical

10/100/1000BASERJ45

T IEEE 802.3

Auto-Negotiation. Abis/Iub/S1/X2

Ethernet

(CC2/CC16B)

(either or)

compatible

Auto-MDI/MDIX 1000BASE-LX 1 1000M optical Or 1 100M optical

IEEE 802.3 SFP (LC)

compatible, 100BASE-FX IEEE 802.3 compatible

2 10M/100M/1000M electrical

10/100/1000BASERJ45

T IEEE 802.3

Auto-Negotiation.

compatible

Auto-MDI/MDIX Abis/Iub/S1/X2 (CCE1)

10GBASE-SR,10G Ethernet

BASE-SW,10GBAS E-LR,10GBASE-L

2 10G optical Or 2 1000M optical

SFP (LC)

W IEEE 802.3 compatible, 1000BASE-LX IEEE 802.3 compatible

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ZXSDR B8200 Product Description

1 Cascading,

10M/100M/1000M

Debugging or Local

Ethernet

electrical

10/100/1000BASERJ45

Auto-Negotiation.

Maintenance

T IEEE 802.3 compatible

Auto-MDI/MDIX 6 pairs

Baseband

Electrical

/Radio

/Optical

Clock

GPS

1

Dry

32 pairs (8,16 or

contacts

24 pairs optional)

EXT

1

Monitor External

/FS/BPN0A/BPN0

SFP (LC)

/BPN2 SMA

DB44 RS485/RS2 32

3.5

CPRI

GPS TX/RX Port NMEA 0183 V3.0 N/A

N/A

Environment Indices Table 3-6

B8200 Working Environment Characteristics Item

Requirement

Temperature

-20 to +55°C

Relative Humidity

5% to 95%

Protection classification

Compliant with IP20 ETSI EN 300 386

Emission and Immunity ETSI TS 125 113 ≤5 Ω; earth resistance can be less than 10 Ω in Ground

lightning-less area with less than 20 lightning storms a year.

Mechanical vibration

ETSI 300019-1-4 ClassM4.1

Transport Temperature

-40°C-+70°C

Storage Temperature

-40°C-+70°C

Storage Relative Humidity

10% to 100%

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ZXSDR B8200 Product Description

3.6

Electromagnetic Compatibility Indices Table 3-7

ZXSDR B8200 Electromagnetic Compatibility Characteristics Item

Requirement

Anti-static protection

Capable of protecting against a contact discharge of ±6000V, Air discharge of ±8000V.

Surge anti-interference

3.7

±2000V between lines and ground.

Reliability Indices The reliability of the ZXSDR B8200 system conforms to the national military GJB/Z299B Electronic Equipment Reliability Estimation Manual and the IEC TR62390 standard. The Reliability characteristics vary at different configurations. The reliability indices are calculated based on typical configuration supporting GUL multi-mode, listed in table 3-8.

Table 3-8

B8200 Reliability Characteristics Item

34

Value

MTBF

≥240,000 hours

MTTR

0.5 hour

Availability index

≥99.999792%

Down duration

≤1.095 min/year

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ZXSDR B8200 Product Description

4

Configurations Principles B8200 is the baseband unit of macro base station, which is composed of the following boards: CC, BP, FS, SA/SE, UES, TAM, PM, FAM, etc. Configuration principles of these boards are described in the following table:

Table 4-1

B8200 Configuration

Board

Configuration Principles Refer to table 2-2 for the key indices of CC boards. At least 1 board is configured by default.

CC

Maximally 2 boards can be configured for GU and LTE respectively or 1+1 backup. UBPG

12 GSM TRXs/board. Maximally 5 boards can be configured.

UBPG3

24 GSM TRXs/board. Maximally 5 boards can be configured.

BPK_e1

BPK_e

BP

BPK_d

BPN0A

BPN0

BPN2

Refer to table 2-5 for the key indices. Maximally 5 boards can be configured. Refer to table 2-5 for the key indices. Maximally 5 boards can be configured. Refer to table 2-5 for the key indices. Maximally 5 boards can be configured. Refer to table 2-6 for the key indices. Maximally 6 boards can be configured. Refer to table 2-6 for the key indices. Maximally 6 boards can be configured. Refer to table 2-8 for the key indices. Maximally 6 boards can be configured in LTE single mode or 5 boards in GUL multi-mode. Refer to table 2-10 for the key indices of FS boards. At least 1

FS

board is configured by default for G/U mode. FS is optional in LTE single mode configuration. Maximally 2 boards can be configured.

SA

Refer to table 2-12 for the interfaces of the 2 types of SA boards. It is configured by default. Refer to table 2-13 for the interfaces of the 2 types of SE boards. It

SE

is configured only when the requirements of dry contacts or E1/T1 exceed SA capacity.

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ZXSDR B8200 Product Description

UES

4 electrical and 2 optical Ethernet interfaces per board. It is configured when L2 Ethernet switch is required. 1 optical interface and 3 HDMI interfaces per board. UCI is configured for connecting to the remote device when remote

UCI

transportation of GPS signal is required and the optical RGPS solution is adopted. UCI-C is configured in the GLONASS system.

TAM

PM FAM

6 DC outputs with customized voltage per board. It is configured for tower amplifier control when TMA is needed. At least 1 board is configured by default. Maximally 2 boards can be configured for 1+1 backup. It is configured by default.

Note: The above table describes the maximum hardware capacity. The actual capacity is up to the licenses configured.

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ZXSDR B8200 Product Description

5

Site Support Cabinets for B8200 When used outdoor, B8200 is usually put into the site support cabinets. Three types of cabinets are provided with certain water- and dust-proof capability, satisfying different accommodation requirements on power, transmission or other third-party equipments. The details are as follows.

5.1

BC8910B/BC8911B BC8910B is the largest cabinet out of three cabinets, including baseband unit shelf, fan and ventilation system, AC/DC power system and additional 4U space reserved for transmission or other equipments. Moreover, BC8910B contains 2 sets of batteries, which maximally supports 2*150AH/135AH. BC8911B has similar hardware structure with BC8910B, except that it contains 1 set of battery and 11U space reserved for transmission or other equipments. BC8910B/BC8911B hardware architecture is shown in the following figure.

Figure 5-1

Physical Structure of BC8910B/BC8911B

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ZXSDR B8200 Product Description

1. Fan and ventilation vessel 2.AC/DC power system 3. Power distribution unit 4. B8200 5. Reserved space (for transmission, etc) 6. Battery

5.2

BC8910A BC8910A is the medium-sized one in the three cabinets. It can be used when there are auxiliary devices should be contained but without battery. There are mainly five parts in BC8910A: baseband unit, power supply system, power distribution module, heat exchanging system and reserved space for transmission or other equipments. Together with the fan system and ventilation vessel, the heat exchanger located in the cabinet door makes the heat exchanging system. The fan system contains fan control element (FCE) and 6 fans. BC8910A hardware architecture is shown in the following figure.

Figure 5-2

Physical Structure of BC8910A (AC Power Supply)

1. Fan and ventilation vessel 2.AC/DC power system 3. B8200 4.Cable chute 5.Lightning Protection 6.Reserved space (for transmission, etc) 7.Heater 8.Heat exchange

In the case of DC power supply, AC/DC power system (5U) should be replaced by DC power distribution with 2U in height.

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ZXSDR B8200 Product Description

Figure 5-3

Physical Structure of BC8910A (DC Power Supply)

1. Fan and ventilation vessel 2.DC power system 3.B8200 4.Cable chute 5.Lightning protection 6.Reserved space (for transmission, etc) 7.Heater 8.Heat exchange

5.3

ZXSDR BS8906 ZXSDR BS8906 is the smallest one out of three cabinets. It is the outdoor compact base station, with two kinds of cabinets: compact Cabinet, consisting of BBU, RSU and supporting modules, and standalone cabinet, consisting of BBU and supporting modules. If used outdoor for containing BBU without many ancillary devices, standalone cabinet can be chosen to accommodate BBU inside. The physical structures are shown in the following figure. Figure 5-4

Physical Structure of ZXSDR BS8906 Standalone Cabinet

Standalone Cabinet 1

5 2 6 3

4 1. Fan control element 2.B8200 3. AC/DC protection module 4. Fan and ventilation vessel 5. Power supply unit 6. Lightning protection/MW indoor unit/SDH

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ZXSDR B8200 Product Description

5.4

Physical Indices Table 5-1

Site Support Cabinet Physical Indices

Item Dimension (H*W*D) (mm *mm*mm) (Without the base)

BC8910B/BC8911B

With silencing cover: 1600*700*780

ZXSDR BS8906

BC8910A

800*600*600

Weight (kg)

Iron:

Iron:

(Full configuration

215(AC)/190(DC)

99 (AC)/76(DC)

without battery and

Aluminum:

Aluminum:

base)

180Kg(AC)/150(DC)

79(AC)/56(DC)

BBU Number

2

1

Battery Capacity

1~2*150AH AGM or

N/A

1~2*135AH GEL Reserved space for

BC8910B: 4U

4U (AC)

transmission etc.

BC8911B: 11U

8U (DC)

(Standalone)

670*300*525

35

1 N/A N/A

Note: If needed, the base is additionally configured for BC8910B/BC8911B, and the cover and base are additionally configured for BC8910A.

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ZXSDR B8200 Product Description

6

Glossary Abbreviations

Full Characteristics rd

3GPP

3 Generation Partnership Project

BP

Baseband Processing

BBU

Base Band processing Unit

BITS

Building Integrated Timing Supply

BSP

Board Support Package

CAPEX

Capital Expenditure

CC

Control & Clock module

CPRI

Common Public Radio Interface

DBS

Data Base Sub-system

DL

Downlink

DTX

Discontinuous transmission

EUTRAN

Evolved Universal Mobile Telecommunications System

FAM

Fan Module

FE

Fast Ethernet

FS

Fabric Switch board

GE

Gigabit Ethernet

GPS

Global Positioning System

GSM

Global System for Mobile communications

HSPA+

HSPA Evolution

LMT

Local Maintenance Terminal

LTE

Long Term Evolution

MDLSD

MAC Downlink Schedule

MicroTCA

Micro Telecommunications Computing Architecture

MIMO

Multi Input Multi Output

MTBF

Mean Time Between Failures

MTTR

Mean Time To Recovery

MULSD

MAC Uplink Schedule

OAM

Operating Administration and Maintenance

OFDMA

Orthogonal Frequency Division Multiple Access

OPEX

Operation Expenditure

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ZXSDR B8200 Product Description

Abbreviations

42

Full Characteristics

OSS

Operation Support Sub-system

PHY

Physical Layer

PM

Power Module

RNLC

Radio Network Layer Control Plane

RNLU

Radio Network Layer User Plane

RRU

Remote Radio Unit

SA

Site Alarm Board

SC-FDMA

Single Carrier Frequency Division Multiple Access

SDR

Software Defined Radio

SE

Site Alarm Extension board

UE

User Equipment

UL

Uplink

UTRAN

UMTS Terrestrial Radio Access Network

WCDMA

Wideband Code Division Multiple Access

WiMAX

Worldwide Interoperability for Microwave Access

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